Patent Assignment Details
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| Reel/Frame: | 012351/0376 | |
| Pages: | 2 |
| | Recorded: | 11/19/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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10001862
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Filing Dt:
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11/19/2001
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Publication #:
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Pub Dt:
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04/04/2002
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Title:
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CHIP PACKAGE CAPABLE OF REDUCING MOISTURE PENETRATION
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Assignee
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| NO. 123, SEC. 3, DA FONG RD. |
| TANTZU TAICHUNG R.O.C., TAIWAN |
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Correspondence name and address
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KLARQUIST SPARKMAN, LLP
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STACEY C. SLATER, ESQ.
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ONE WORLD TRADE CENTER, SUITE 1600
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121 S.W. SALMON STREET
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PORTLAND, OR 97204-2988
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