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Reel/Frame:059723/0382   Pages: 236
Recorded: 04/15/2022
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 524
Page 5 of 6
Pages: 1 2 3 4 5 6
1
Patent #:
NONE
Issue Dt:
Application #:
10939292
Filing Dt:
09/10/2004
Publication #:
US20050035466
Pub Dt:
02/17/2005
Title:
Wire bonding method for copper interconnects in semiconductor devices
2
Patent #:
NONE
Issue Dt:
Application #:
10951430
Filing Dt:
09/28/2004
Publication #:
US20060068218
Pub Dt:
03/30/2006
Title:
Whisker-free lead frames
3
Patent #:
7221173
Issue Dt:
05/22/2007
Application #:
10953291
Filing Dt:
09/29/2004
Publication #:
US20060066327
Pub Dt:
03/30/2006
Title:
METHOD AND STRUCTURES FOR TESTING A SEMICONDUCTOR WAFER PRIOR TO PERFORMING A FLIP CHIP BUMPING PROCESS
4
Patent #:
7145232
Issue Dt:
12/05/2006
Application #:
10954940
Filing Dt:
09/30/2004
Publication #:
US20060071327
Pub Dt:
04/06/2006
Title:
CONSTRUCTION TO IMPROVE THERMAL PERFORMANCE AND REDUCE DIE BACKSIDE WARPAGE
5
Patent #:
7367486
Issue Dt:
05/06/2008
Application #:
10955912
Filing Dt:
09/30/2004
Publication #:
US20060065696
Pub Dt:
03/30/2006
Title:
SYSTEM AND METHOD FOR FORMING SOLDER JOINTS
6
Patent #:
7115985
Issue Dt:
10/03/2006
Application #:
10955913
Filing Dt:
09/30/2004
Publication #:
US20060065969
Pub Dt:
03/30/2006
Title:
REINFORCED BOND PAD FOR A SEMICONDUCTOR DEVICE
7
Patent #:
7122892
Issue Dt:
10/17/2006
Application #:
10960680
Filing Dt:
10/07/2004
Publication #:
US20060076676
Pub Dt:
04/13/2006
Title:
MULTI-CHIP INTEGRATED CIRCUIT MODULE FOR HIGH-FREQUENCY OPERATION
8
Patent #:
7352062
Issue Dt:
04/01/2008
Application #:
10979491
Filing Dt:
11/02/2004
Publication #:
US20050062143
Pub Dt:
03/24/2005
Title:
INTEGRATED CIRCUIT PACKAGE DESIGN
9
Patent #:
7221042
Issue Dt:
05/22/2007
Application #:
10997630
Filing Dt:
11/24/2004
Publication #:
US20060108670
Pub Dt:
05/25/2006
Title:
LEADFRAME DESIGNS FOR INTEGRATED CIRCUIT PLASTIC PACKAGES
10
Patent #:
NONE
Issue Dt:
Application #:
11012838
Filing Dt:
12/15/2004
Publication #:
US20050093111
Pub Dt:
05/05/2005
Title:
System and method for using film deposition techniques to provide an antenna within an integrated circuit package
11
Patent #:
7224047
Issue Dt:
05/29/2007
Application #:
11015534
Filing Dt:
12/18/2004
Publication #:
US20060131707
Pub Dt:
06/22/2006
Title:
SEMICONDUCTOR DEVICE PACKAGE WITH REDUCED LEAKAGE
12
Patent #:
7956451
Issue Dt:
06/07/2011
Application #:
11015535
Filing Dt:
12/18/2004
Publication #:
US20060131704
Pub Dt:
06/22/2006
Title:
PACKAGES FOR ENCAPSULATED SEMICONDUCTOR DEVICES AND METHOD OF MAKING SAME
13
Patent #:
7203877
Issue Dt:
04/10/2007
Application #:
11028695
Filing Dt:
01/04/2005
Publication #:
US20060150041
Pub Dt:
07/06/2006
Title:
FAILURE ANALYSIS AND TESTING OF SEMI-CONDUCTOR DEVICES USING INTELLIGENT SOFTWARE ON AUTOMATED TEST EQUIPMENT (ATE)
14
Patent #:
7235422
Issue Dt:
06/26/2007
Application #:
11049246
Filing Dt:
02/02/2005
Publication #:
US20060172465
Pub Dt:
08/03/2006
Title:
DEVICE PACKAGES
15
Patent #:
7242090
Issue Dt:
07/10/2007
Application #:
11049407
Filing Dt:
02/02/2005
Publication #:
US20060170095
Pub Dt:
08/03/2006
Title:
DEVICE PACKAGE
16
Patent #:
7433192
Issue Dt:
10/07/2008
Application #:
11055712
Filing Dt:
02/10/2005
Publication #:
US20060139896
Pub Dt:
06/29/2006
Title:
PACKAGING FOR ELECTRONIC MODULES
17
Patent #:
7675168
Issue Dt:
03/09/2010
Application #:
11065838
Filing Dt:
02/25/2005
Publication #:
US20060192300
Pub Dt:
08/31/2006
Title:
INTEGRATED CIRCUIT WITH STAGGERED DIFFERENTIAL WIRE BOND PAIRS
18
Patent #:
7081672
Issue Dt:
07/25/2006
Application #:
11073802
Filing Dt:
03/07/2005
Title:
SUBSTRATE VIA LAYOUT TO IMPROVE BIAS HUMIDITY TESTING RELIABILITY
19
Patent #:
7132735
Issue Dt:
11/07/2006
Application #:
11074358
Filing Dt:
03/07/2005
Publication #:
US20060197195
Pub Dt:
09/07/2006
Title:
INTEGRATED CIRCUIT PACKAGE WITH LEAD FINGERS EXTENDING INTO A SLOT OF A DIE PADDLE
20
Patent #:
7491579
Issue Dt:
02/17/2009
Application #:
11079028
Filing Dt:
03/14/2005
Publication #:
US20060236270
Pub Dt:
10/19/2006
Title:
COMPOSABLE SYSTEM-IN-PACKAGE INTEGRATED CIRCUITS AND PROCESS OF COMPOSING THE SAME
21
Patent #:
7224076
Issue Dt:
05/29/2007
Application #:
11080859
Filing Dt:
03/15/2005
Publication #:
US20050156312
Pub Dt:
07/21/2005
Title:
ELECTRONIC COMPONENT PACKAGE
22
Patent #:
7408246
Issue Dt:
08/05/2008
Application #:
11095929
Filing Dt:
03/31/2005
Publication #:
US20060220194
Pub Dt:
10/05/2006
Title:
CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES
23
Patent #:
7005880
Issue Dt:
02/28/2006
Application #:
11097796
Filing Dt:
04/02/2005
Title:
METHOD OF TESTING ELECTRONIC WAFERS HAVING LEAD-FREE SOLDER CONTACTS
24
Patent #:
7319272
Issue Dt:
01/15/2008
Application #:
11097895
Filing Dt:
04/01/2005
Publication #:
US20060223341
Pub Dt:
10/05/2006
Title:
BALL ASSIGNMENT SYSTEM
25
Patent #:
7370257
Issue Dt:
05/06/2008
Application #:
11102156
Filing Dt:
04/08/2005
Publication #:
US20060242522
Pub Dt:
10/26/2006
Title:
TEST VEHICLE DATA ANALYSIS
26
Patent #:
7053639
Issue Dt:
05/30/2006
Application #:
11131885
Filing Dt:
05/18/2005
Title:
PROBING FIXTURE FOR SEMICONDUCTOR WAFER
27
Patent #:
7354790
Issue Dt:
04/08/2008
Application #:
11132751
Filing Dt:
05/18/2005
Publication #:
US20060160269
Pub Dt:
07/20/2006
Title:
METHOD AND APPARATUS FOR AVOIDING DICING CHIP-OUTS IN INTEGRATED CIRCUIT DIE
28
Patent #:
7528616
Issue Dt:
05/05/2009
Application #:
11140455
Filing Dt:
05/27/2005
Publication #:
US20060267615
Pub Dt:
11/30/2006
Title:
ZERO ATE INSERTION FORCE INTERPOSER DAUGHTER CARD
29
Patent #:
8664759
Issue Dt:
03/04/2014
Application #:
11158370
Filing Dt:
06/22/2005
Publication #:
US20060289988
Pub Dt:
12/28/2006
Title:
INTEGRATED CIRCUIT WITH HEAT CONDUCTING STRUCTURES FOR LOCALIZED THERMAL CONTROL
30
Patent #:
7541674
Issue Dt:
06/02/2009
Application #:
11158435
Filing Dt:
06/22/2005
Publication #:
US20050242431
Pub Dt:
11/03/2005
Title:
Integrated circuit die for wire bonding and flip-chip mounting
31
Patent #:
7327029
Issue Dt:
02/05/2008
Application #:
11235920
Filing Dt:
09/27/2005
Publication #:
US20070069368
Pub Dt:
03/29/2007
Title:
INTEGRATED CIRCUIT DEVICE INCORPORATING METALLURIGICAL BOND TO ENHANCE THERMAL CONDUCTION TO A HEAT SINK
32
Patent #:
7582938
Issue Dt:
09/01/2009
Application #:
11258253
Filing Dt:
10/25/2005
Publication #:
US20060033163
Pub Dt:
02/16/2006
Title:
I/O AND POWER ESD PROTECTION CIRCUITS BY ENHANCING SUBSTRATE-BIAS IN DEEP-SUBMICRON CMOS PROCESS
33
Patent #:
7405476
Issue Dt:
07/29/2008
Application #:
11260334
Filing Dt:
10/27/2005
Publication #:
US20070096303
Pub Dt:
05/03/2007
Title:
ASYMMETRIC ALIGNMENT OF SUBSTRATE INTERCONNECT TO SEMICONDUCTOR DIE
34
Patent #:
8049340
Issue Dt:
11/01/2011
Application #:
11277188
Filing Dt:
03/22/2006
Publication #:
US20070222084
Pub Dt:
09/27/2007
Title:
DEVICE FOR AVOIDING PARASITIC CAPACITANCE IN AN INTEGRATED CIRCUIT PACKAGE
35
Patent #:
7298036
Issue Dt:
11/20/2007
Application #:
11283340
Filing Dt:
11/18/2005
Publication #:
US20070114644
Pub Dt:
05/24/2007
Title:
SCALING OF FUNCTIONAL ASSIGNMENTS IN PACKAGES
36
Patent #:
7504728
Issue Dt:
03/17/2009
Application #:
11298030
Filing Dt:
12/09/2005
Publication #:
US20070134903
Pub Dt:
06/14/2007
Title:
INTEGRATED CIRCUIT HAVING BOND PAD WITH IMPROVED THERMAL AND MECHANICAL PROPERTIES
37
Patent #:
7379836
Issue Dt:
05/27/2008
Application #:
11300789
Filing Dt:
12/14/2005
Publication #:
US20070136023
Pub Dt:
06/14/2007
Title:
METHOD OF USING AUTOMATED TEST EQUIPMENT TO SCREEN FOR LEAKAGE INDUCING DEFECTS AFTER CALIBRATION TO INTRINSIC LEAKAGE
38
Patent #:
7541220
Issue Dt:
06/02/2009
Application #:
11302690
Filing Dt:
12/14/2005
Publication #:
US20060097367
Pub Dt:
05/11/2006
Title:
INTEGRATED CIRCUIT DEVICE HAVING FLEXIBLE LEADFRAME
39
Patent #:
7498664
Issue Dt:
03/03/2009
Application #:
11304862
Filing Dt:
12/14/2005
Publication #:
US20070132083
Pub Dt:
06/14/2007
Title:
SEMICONDUCTOR PACKAGE HAVING INCREASED RESISTANCE TO ELECTROSTATIC DISCHARGE
40
Patent #:
RE41516
Issue Dt:
08/17/2010
Application #:
11324119
Filing Dt:
12/30/2005
Title:
SOCKETLESS/BOARDLESS TEST INTERPOSER CARD
41
Patent #:
7737564
Issue Dt:
06/15/2010
Application #:
11334870
Filing Dt:
01/19/2006
Publication #:
US20070164451
Pub Dt:
07/19/2007
Title:
POWER CONFIGURATION METHOD FOR STRUCTURED ASICS
42
Patent #:
7394028
Issue Dt:
07/01/2008
Application #:
11360200
Filing Dt:
02/23/2006
Publication #:
US20070194456
Pub Dt:
08/23/2007
Title:
FLEXIBLE CIRCUIT SUBSTRATE FOR FLIP-CHIP-ON-FLEX APPLICATIONS
43
Patent #:
7479695
Issue Dt:
01/20/2009
Application #:
11375302
Filing Dt:
03/14/2006
Publication #:
US20070216034
Pub Dt:
09/20/2007
Title:
LOW THERMAL RESISTANCE ASSEMBLY FOR FLIP CHIP APPLICATIONS
44
Patent #:
7705473
Issue Dt:
04/27/2010
Application #:
11385086
Filing Dt:
03/21/2006
Publication #:
US20060157871
Pub Dt:
07/20/2006
Title:
METHODS AND APPARATUS FOR DETERMINING PAD HEIGHT FOR A WIRE-BONDING OPERATION IN AN INTEGRATED CIRCUIT
45
Patent #:
7443042
Issue Dt:
10/28/2008
Application #:
11385245
Filing Dt:
03/21/2006
Publication #:
US20060158856
Pub Dt:
07/20/2006
Title:
METHODS AND APPARATUS FOR WIRE BONDING WITH WIRE LENGTH ADJUSTMENT IN AN INTEGRATED CIRCUIT
46
Patent #:
8025201
Issue Dt:
09/27/2011
Application #:
11395779
Filing Dt:
03/31/2006
Publication #:
US20060172524
Pub Dt:
08/03/2006
Title:
METHODS AND APPARATUS FOR INTEGRATED CIRCUIT BALL BONDING WITH SUBSTANTIALLY PERPENDICULAR WIRE BOND PROFILES
47
Patent #:
7646091
Issue Dt:
01/12/2010
Application #:
11399723
Filing Dt:
04/06/2006
Publication #:
US20070235849
Pub Dt:
10/11/2007
Title:
SEMICONDUCTOR PACKAGE AND METHOD USING ISOLATED VSS PLANE TO ACCOMMODATE HIGH SPEED CIRCUITRY GROUND ISOLATION
48
Patent #:
7301231
Issue Dt:
11/27/2007
Application #:
11448560
Filing Dt:
06/07/2006
Publication #:
US20060226535
Pub Dt:
10/12/2006
Title:
REINFORCED BOND PAD FOR A SEMICONDUCTOR DEVICE
49
Patent #:
7952206
Issue Dt:
05/31/2011
Application #:
11459249
Filing Dt:
07/21/2006
Publication #:
US20070069394
Pub Dt:
03/29/2007
Title:
SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
50
Patent #:
7800879
Issue Dt:
09/21/2010
Application #:
11460459
Filing Dt:
07/27/2006
Publication #:
US20080026503
Pub Dt:
01/31/2008
Title:
ON-CHIP SENSOR ARRAY FOR TEMPERATURE MANAGEMENT IN INTEGRATED CIRCUITS
51
Patent #:
7633152
Issue Dt:
12/15/2009
Application #:
11468901
Filing Dt:
08/31/2006
Publication #:
US20070064398
Pub Dt:
03/22/2007
Title:
HEAT DISSIPATION IN INTEGRATED CIRCUITS
52
Patent #:
8319343
Issue Dt:
11/27/2012
Application #:
11469960
Filing Dt:
09/05/2006
Publication #:
US20070063352
Pub Dt:
03/22/2007
Title:
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
53
Patent #:
7465655
Issue Dt:
12/16/2008
Application #:
11494221
Filing Dt:
07/27/2006
Publication #:
US20060264024
Pub Dt:
11/23/2006
Title:
INTEGRATED CIRCUIT WITH SUBSTANTIALLY PERPENDICULAR WIRE BONDS
54
Patent #:
7423341
Issue Dt:
09/09/2008
Application #:
11505152
Filing Dt:
08/16/2006
Publication #:
US20080042262
Pub Dt:
02/21/2008
Title:
PLASTIC OVERMOLDED PACKAGES WITH MECHANICALLY DECOUPLED LID ATTACH ATTACHMENT
55
Patent #:
7456498
Issue Dt:
11/25/2008
Application #:
11506680
Filing Dt:
08/18/2006
Publication #:
US20080042267
Pub Dt:
02/21/2008
Title:
INTEGRATED CIRCUIT PACKAGE AND SYSTEM INTERFACE
56
Patent #:
7271485
Issue Dt:
09/18/2007
Application #:
11530550
Filing Dt:
09/11/2006
Title:
SYSTEMS AND METHODS FOR DISTRIBUTING I/O IN A SEMICONDUCTOR DEVICE
57
Patent #:
7804167
Issue Dt:
09/28/2010
Application #:
11565701
Filing Dt:
12/01/2006
Publication #:
US20080128919
Pub Dt:
06/05/2008
Title:
WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O
58
Patent #:
7557303
Issue Dt:
07/07/2009
Application #:
11641989
Filing Dt:
12/18/2006
Publication #:
US20080142250
Pub Dt:
06/19/2008
Title:
ELECTRONIC COMPONENT CONNECTION SUPPORT STRUCTURES INCLUDING AIR AS A DIELECTRIC
59
Patent #:
7430700
Issue Dt:
09/30/2008
Application #:
11670031
Filing Dt:
02/01/2007
Publication #:
US20070179745
Pub Dt:
08/02/2007
Title:
FAILURE ANALYSIS AND TESTING OF SEMI-CONDUCTOR DEVICES USING INTELLIGENT SOFTWARE ON AUTOMATED TEST EQUIPMENT (ATE)
60
Patent #:
7709861
Issue Dt:
05/04/2010
Application #:
11684674
Filing Dt:
03/12/2007
Publication #:
US20080061319
Pub Dt:
03/13/2008
Title:
SYSTEMS AND METHODS FOR SUPPORTING A SUBSET OF MULTIPLE INTERFACE TYPES IN A SEMICONDUCTOR DEVICE
61
Patent #:
7667321
Issue Dt:
02/23/2010
Application #:
11717227
Filing Dt:
03/12/2007
Publication #:
US20080227284
Pub Dt:
09/18/2008
Title:
WIRE BONDING METHOD AND RELATED DEVICE FOR HIGH-FREQUENCY APPLICATIONS
62
Patent #:
7479703
Issue Dt:
01/20/2009
Application #:
11772267
Filing Dt:
07/02/2007
Publication #:
US20090008767
Pub Dt:
01/08/2009
Title:
INTEGRATED CIRCUIT PACKAGE WITH SPUTTERED HEAT SINK FOR IMPROVED THERMAL PERFORMANCE
63
Patent #:
7541669
Issue Dt:
06/02/2009
Application #:
11788346
Filing Dt:
04/19/2007
Publication #:
US20070241433
Pub Dt:
10/18/2007
Title:
SEMICONDUCTOR DEVICE PACKAGE WITH BASE FEATURES TO REDUCE LEAKAGE
64
Patent #:
7429502
Issue Dt:
09/30/2008
Application #:
11868624
Filing Dt:
10/08/2007
Publication #:
US20080026508
Pub Dt:
01/31/2008
Title:
INTEGRATED CIRCUIT DEVICE INCORPORATING METALLURGICAL BOND TO ENHANCE THERMAL CONDUCTION TO A HEAT SINK
65
Patent #:
7777333
Issue Dt:
08/17/2010
Application #:
11884328
Filing Dt:
05/30/2008
Publication #:
US20090072393
Pub Dt:
03/19/2009
Title:
STRUCTURE AND METHOD FOR FABRICATING FLIP CHIP DEVICES
66
Patent #:
7888257
Issue Dt:
02/15/2011
Application #:
11973859
Filing Dt:
10/10/2007
Publication #:
US20090098687
Pub Dt:
04/16/2009
Title:
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BONDS
67
Patent #:
7750460
Issue Dt:
07/06/2010
Application #:
12034745
Filing Dt:
02/21/2008
Publication #:
US20090212413
Pub Dt:
08/27/2009
Title:
BALL GRID ARRAY PACKAGE LAYOUT SUPPORTING MANY VOLTAGE SPLITS AND FLEXIBLE SPLIT LOCATIONS
68
Patent #:
7968999
Issue Dt:
06/28/2011
Application #:
12038911
Filing Dt:
02/28/2008
Publication #:
US20090218680
Pub Dt:
09/03/2009
Title:
PROCESS OF GROUNDING HEAT SPREADER/STIFFENER TO A FLIP CHIP PACKAGE USING SOLDER AND FILM ADHESIVE
69
Patent #:
7671450
Issue Dt:
03/02/2010
Application #:
12060387
Filing Dt:
04/01/2008
Publication #:
US20090152689
Pub Dt:
06/18/2009
Title:
INTEGRATED CIRCUIT PACKAGE FOR HIGH-SPEED SIGNALS
70
Patent #:
8134232
Issue Dt:
03/13/2012
Application #:
12061728
Filing Dt:
04/03/2008
Publication #:
US20090250805
Pub Dt:
10/08/2009
Title:
HEAT DISSIPATION FOR INTEGRATED CIRCUIT
71
Patent #:
7566953
Issue Dt:
07/28/2009
Application #:
12079124
Filing Dt:
03/25/2008
Publication #:
US20080173989
Pub Dt:
07/24/2008
Title:
LEADFRAME DESIGNS FOR PLASTIC OVERMOLD PACKAGES
72
Patent #:
7554133
Issue Dt:
06/30/2009
Application #:
12119575
Filing Dt:
05/13/2008
Title:
PAD CURRENT SPLITTING
73
Patent #:
8350375
Issue Dt:
01/08/2013
Application #:
12121363
Filing Dt:
05/15/2008
Publication #:
US20090283904
Pub Dt:
11/19/2009
Title:
FLIPCHIP BUMP PATTERNS FOR EFFICIENT I-MESH POWER DISTRIBUTION SCHEMES
74
Patent #:
7919354
Issue Dt:
04/05/2011
Application #:
12139185
Filing Dt:
06/13/2008
Publication #:
US20080248612
Pub Dt:
10/09/2008
Title:
ASYMMETRIC ALIGNMENT OF SUBSTRATE INTERCONNECT TO SEMICONDUCTOR DIE
75
Patent #:
7671436
Issue Dt:
03/02/2010
Application #:
12151108
Filing Dt:
05/02/2008
Publication #:
US20090273078
Pub Dt:
11/05/2009
Title:
ELECTRONIC PACKAGES
76
Patent #:
7724359
Issue Dt:
05/25/2010
Application #:
12154794
Filing Dt:
05/27/2008
Publication #:
US20090298286
Pub Dt:
12/03/2009
Title:
METHOD OF MAKING ELECTRONIC ENTITIES
77
Patent #:
7776648
Issue Dt:
08/17/2010
Application #:
12160233
Filing Dt:
07/08/2008
Publication #:
US20090001561
Pub Dt:
01/01/2009
Title:
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Assignor
1
CORTLAND CAPITAL MARKET SERVICES LLC
Exec Dt:
04/01/2022
Assignees
1
HILCO PATENT ACQUISITION 56, LLC
401 N. MICHIGAN AVE., SUITE 1630
CHICAGO, ILLINOIS 60611
2
BELL SEMICONDUCTOR, LLC
401 N. MICHIGAN AVE., SUITE 1630
CHICAGO, ILLINOIS 60611
3
BELL NORTHERN RESEARCH, LLC
401 N. MICHIGAN AVE., SUITE 1630
CHICAGO, ILLINOIS 60611
Correspondence name and address
JOSHUA GAMMON
401 N. MICHIGAN AVE.
SUITE 1630
CHICAGO, IL 60611

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