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Reel/Frame:059723/0382   Pages: 236
Recorded: 04/15/2022
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 524
Page 6 of 6
Pages: 1 2 3 4 5 6
1
Patent #:
8183698
Issue Dt:
05/22/2012
Application #:
12678405
Filing Dt:
03/16/2010
Publication #:
US20100201000
Pub Dt:
08/12/2010
Title:
BOND PAD SUPPORT STRUCTURE FOR SEMICONDUCTOR DEVICE
2
Patent #:
8222745
Issue Dt:
07/17/2012
Application #:
12689806
Filing Dt:
01/19/2010
Publication #:
US20110176278
Pub Dt:
07/21/2011
Title:
INTEGRATED HEAT SINK
3
Patent #:
8084857
Issue Dt:
12/27/2011
Application #:
12692209
Filing Dt:
01/22/2010
Publication #:
US20100120198
Pub Dt:
05/13/2010
Title:
METHOD AND ARTICLE OF MANUFACTURE FOR WIRE BONDING WITH STAGGERED DIFFERENTIAL WIRE BOND PAIRS
4
Patent #:
8492911
Issue Dt:
07/23/2013
Application #:
12840016
Filing Dt:
07/20/2010
Publication #:
US20120020028
Pub Dt:
01/26/2012
Title:
STACKED INTERCONNECT HEAT SINK
5
Patent #:
8987137
Issue Dt:
03/24/2015
Application #:
12969836
Filing Dt:
12/16/2010
Publication #:
US20120153492
Pub Dt:
06/21/2012
Title:
METHOD OF FABRICATION OF THROUGH-SUBSTRATE VIAS
6
Patent #:
8742535
Issue Dt:
06/03/2014
Application #:
12969852
Filing Dt:
12/16/2010
Publication #:
US20120153430
Pub Dt:
06/21/2012
Title:
INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS INTO INTEGRATED CIRCUIT DESIGNS
7
Patent #:
8547681
Issue Dt:
10/01/2013
Application #:
13032429
Filing Dt:
02/22/2011
Publication #:
US20120212878
Pub Dt:
08/23/2012
Title:
DECOUPLING CAPACITOR
8
Patent #:
8133799
Issue Dt:
03/13/2012
Application #:
13041674
Filing Dt:
03/07/2011
Publication #:
US20110250742
Pub Dt:
10/13/2011
Title:
CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES
9
Patent #:
8653375
Issue Dt:
02/18/2014
Application #:
13059502
Filing Dt:
02/17/2011
Publication #:
US20110155418
Pub Dt:
06/30/2011
Title:
MITIGATION OF WHISKERS IN SN-FILMS
10
Patent #:
8507317
Issue Dt:
08/13/2013
Application #:
13093032
Filing Dt:
04/25/2011
Publication #:
US20110195544
Pub Dt:
08/11/2011
Title:
SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
11
Patent #:
8269280
Issue Dt:
09/18/2012
Application #:
13110581
Filing Dt:
05/18/2011
Publication #:
US20110215410
Pub Dt:
09/08/2011
Title:
I/O AND POWER ESD PROTECTION CIRCUITS BY ENHANCING SUBSTRATE-BIAS IN DEEP-SUBMICRON CMOS PROCESS
12
Patent #:
8384205
Issue Dt:
02/26/2013
Application #:
13174970
Filing Dt:
07/01/2011
Publication #:
US20110260324
Pub Dt:
10/27/2011
Title:
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE
13
Patent #:
8502372
Issue Dt:
08/06/2013
Application #:
13217857
Filing Dt:
08/25/2011
Publication #:
US20120049353
Pub Dt:
03/01/2012
Title:
LOW-COST 3D FACE-TO-FACE OUT ASSEMBLY
14
Patent #:
8288269
Issue Dt:
10/16/2012
Application #:
13252632
Filing Dt:
10/04/2011
Publication #:
US20120021599
Pub Dt:
01/26/2012
Title:
METHODS FOR AVOIDING PARASITIC CAPACITANCE IN AN INTEGRATED CIRCUIT PACKAGE
15
Patent #:
NONE
Issue Dt:
Application #:
13344207
Filing Dt:
01/05/2012
Publication #:
US20120111927
Pub Dt:
05/10/2012
Title:
ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
16
Patent #:
NONE
Issue Dt:
Application #:
13552266
Filing Dt:
07/18/2012
Publication #:
US20120280023
Pub Dt:
11/08/2012
Title:
SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRITTLE FRACTURE
17
Patent #:
NONE
Issue Dt:
Application #:
13656092
Filing Dt:
10/19/2012
Publication #:
US20130056868
Pub Dt:
03/07/2013
Title:
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
18
Patent #:
8869389
Issue Dt:
10/28/2014
Application #:
13677547
Filing Dt:
11/15/2012
Publication #:
US20130067743
Pub Dt:
03/21/2013
Title:
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE PACKAGE
19
Patent #:
8580621
Issue Dt:
11/12/2013
Application #:
13752524
Filing Dt:
01/29/2013
Publication #:
US20130149857
Pub Dt:
06/13/2013
Title:
SOLDER INTERCONNECT BY ADDITION OF COPPER
20
Patent #:
8653357
Issue Dt:
02/18/2014
Application #:
13775922
Filing Dt:
02/25/2013
Publication #:
US20130167895
Pub Dt:
07/04/2013
Title:
METHOD FOR HEAT DISSIPATION ON SEMICONDUCTOR DEVICE
21
Patent #:
9054064
Issue Dt:
06/09/2015
Application #:
13921707
Filing Dt:
06/19/2013
Publication #:
US20130280864
Pub Dt:
10/24/2013
Title:
STACKED INTERCONNECT HEAT SINK
22
Patent #:
NONE
Issue Dt:
Application #:
13934110
Filing Dt:
07/02/2013
Publication #:
US20140015127
Pub Dt:
01/16/2014
Title:
CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
23
Patent #:
9613847
Issue Dt:
04/04/2017
Application #:
14251258
Filing Dt:
04/11/2014
Publication #:
US20140220760
Pub Dt:
08/07/2014
Title:
INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS INTO INTEGRATED CIRCUIT DESIGNS
24
Patent #:
NONE
Issue Dt:
Application #:
14678223
Filing Dt:
04/03/2015
Publication #:
US20150214130
Pub Dt:
07/30/2015
Title:
STACKED INTERCONNECT HEAT SINK
Assignor
1
CORTLAND CAPITAL MARKET SERVICES LLC
Exec Dt:
04/01/2022
Assignees
1
HILCO PATENT ACQUISITION 56, LLC
401 N. MICHIGAN AVE., SUITE 1630
CHICAGO, ILLINOIS 60611
2
BELL SEMICONDUCTOR, LLC
401 N. MICHIGAN AVE., SUITE 1630
CHICAGO, ILLINOIS 60611
3
BELL NORTHERN RESEARCH, LLC
401 N. MICHIGAN AVE., SUITE 1630
CHICAGO, ILLINOIS 60611
Correspondence name and address
JOSHUA GAMMON
401 N. MICHIGAN AVE.
SUITE 1630
CHICAGO, IL 60611

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