Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 064952/0391 | |
| Pages: | 8 |
| | Recorded: | 09/19/2023 | | |
| Attorney Dkt #: | 20-1071-US-DIV |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18469374
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Filing Dt:
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09/18/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Title:
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Method for Forming a Buried Metal Line in a Semiconductor Substrate
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Assignee
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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Correspondence name and address
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MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
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300 SOUTH WACKER DRIVE
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3100
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CHICAGO, IL 60606
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05/25/2024 11:23 PM
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