Patent Assignment Details
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| Reel/Frame: | 025703/0395 | |
| Pages: | 4 |
| | Recorded: | 12/03/2010 | | |
| Attorney Dkt #: | 2515.0302 CIP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/07/2014
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Application #:
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12959709
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Filing Dt:
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12/03/2010
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Publication #:
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Pub Dt:
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09/27/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING PAD LAYOUT FOR FLIPCHIP SEMICONDUCTOR DIE
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ROBERT D. ATKINS
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605 W. KNOW ROAD
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SUITE 104
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TEMPE, ARIZONA 85284
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