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Total properties:
26
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Patent #:
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|
Issue Dt:
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10/03/1995
|
Application #:
|
07962222
|
Filing Dt:
|
08/20/1993
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Title:
|
METHODS FOR PRODUCING PACKAGED INTEGRATED CIRCUIT DEVICES AND PACKAGEDINTEGRATED CIRCUIT DEVICES PRODUCED THEREBY
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|
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Patent #:
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|
Issue Dt:
|
08/20/1996
|
Application #:
|
08274251
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Filing Dt:
|
07/13/1994
|
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Title:
|
METHODS FOR PRODUCING INTERGRATED CIRCUIT DEVICES
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|
|
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Patent #:
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|
Issue Dt:
|
02/10/1998
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Application #:
|
08602853
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Filing Dt:
|
06/17/1996
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Title:
|
METHOD AND APPARATUS FOR PRODUCING INTEGRATED CIRCUIT DEVICES
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|
|
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Patent #:
|
|
Issue Dt:
|
09/12/2000
|
Application #:
|
08681598
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Filing Dt:
|
07/29/1996
|
|
Title:
|
METHODS OF PRODUCING INTEGRATED CIRCUIT DEVICES
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|
|
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Patent #:
|
|
Issue Dt:
|
03/21/2000
|
Application #:
|
08682556
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Filing Dt:
|
08/19/1996
|
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Title:
|
METHODS AND APPARATUS FOR PRODUCING INTEGRATED CIRCUIT DEVICES
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|
|
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Patent #:
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|
Issue Dt:
|
02/08/2000
|
Application #:
|
08765473
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Filing Dt:
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02/21/1997
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Title:
|
PROCESS FOR MANUFACTURING SOLDER LEADS ON A SEMICONDUCTOR DEVICE PACKAGE
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Patent #:
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|
Issue Dt:
|
11/09/1999
|
Application #:
|
08952019
|
Filing Dt:
|
02/27/1998
|
|
Title:
|
BONDING MACHINE
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|
|
|
|
Patent #:
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|
Issue Dt:
|
11/11/2003
|
Application #:
|
09601895
|
Filing Dt:
|
09/22/2000
|
|
Title:
|
INTEGRATED CIRCUIT DEVICE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/17/2004
|
Application #:
|
09725166
|
Filing Dt:
|
11/29/2000
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|
Publication #:
|
|
Pub Dt:
|
08/30/2001
| | | | |
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Title:
|
METHODS FOR PRODUCING PACKAGED INTEGRATED CIRCUIT DEVICES & PACKAGED INTEGRATED CIRCUIT DEVICES PRODUCED THEREBY
|
|
|
|
|
Patent #:
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|
Issue Dt:
|
09/23/2003
|
Application #:
|
09758906
|
Filing Dt:
|
01/11/2001
|
|
Publication #:
|
|
Pub Dt:
|
05/01/2003
| | | | |
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Title:
|
PACKAGED INTEGRATED CIRCUITS AND METHODS OF PRODUCING THEREOF
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|
|
|
|
Patent #:
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|
Issue Dt:
|
12/05/2006
|
Application #:
|
09922770
|
Filing Dt:
|
08/07/2001
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|
Publication #:
|
|
Pub Dt:
|
03/07/2002
| | | | |
|
Title:
|
METHODS FOR PRODUCING PACKAGED INTEGRATED CIRCUIT DEVICES & PACKAGED INTEGRATED CIRCUIT DEVICES PRODUCED THEREBY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/25/2006
|
Application #:
|
10277498
|
Filing Dt:
|
10/22/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
|
Title:
|
METHODS FOR PRODUCING PACKAGED INTEGRATED CIRCUIT DEVICES AND PACKAGED INTEGRATED CIRCUIT DEVICES PRODUCED THEREBY
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2007
|
Application #:
|
10385555
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Filing Dt:
|
03/11/2003
|
|
Publication #:
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|
Pub Dt:
|
08/14/2003
| | | | |
|
Title:
|
INTEGRATED CIRCUIT DEVICE
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|
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|
Patent #:
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|
Issue Dt:
|
08/05/2008
|
Application #:
|
10451564
|
Filing Dt:
|
05/03/2004
|
|
Publication #:
|
|
Pub Dt:
|
01/18/2007
| | | | |
|
Title:
|
PACKAGED INTEGRATED CIRCUITS AND METHODS OF PRODUCING THEREOF
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|
|
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|
Patent #:
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|
Issue Dt:
|
12/06/2005
|
Application #:
|
10462576
|
Filing Dt:
|
06/16/2003
|
|
Publication #:
|
|
Pub Dt:
|
12/16/2004
| | | | |
|
Title:
|
METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
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|
Patent #:
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|
Issue Dt:
|
03/20/2007
|
Application #:
|
10884058
|
Filing Dt:
|
07/02/2004
|
|
Publication #:
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|
Pub Dt:
|
05/19/2005
| | | | |
|
Title:
|
METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
|
09/04/2007
|
Application #:
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11125624
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Filing Dt:
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05/10/2005
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Publication #:
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|
Pub Dt:
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09/22/2005
| | | | |
|
Title:
|
METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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08/24/2010
|
Application #:
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11588439
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Filing Dt:
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10/26/2006
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Publication #:
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Pub Dt:
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02/22/2007
| | | | |
|
Title:
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INTEGRATED CIRCUIT DEVICE
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Patent #:
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Issue Dt:
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08/24/2010
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Application #:
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11588439
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Filing Dt:
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10/26/2006
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Publication #:
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Pub Dt:
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02/22/2007
| | | | |
|
Title:
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INTEGRATED CIRCUIT DEVICE
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Patent #:
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Issue Dt:
|
05/10/2011
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Application #:
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11588489
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Filing Dt:
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10/26/2006
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Publication #:
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|
Pub Dt:
|
02/22/2007
| | | | |
|
Title:
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CHIP PACKAGES WITH COVERS
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Patent #:
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Issue Dt:
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05/03/2011
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Application #:
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11590616
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Filing Dt:
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10/31/2006
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Publication #:
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Pub Dt:
|
05/01/2008
| | | | |
|
Title:
|
WAFER-LEVEL FABRICATION OF LIDDED CHIPS WITH ELECTRODEPOSITED DIELECTRIC COATING
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Patent #:
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Issue Dt:
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05/03/2011
|
Application #:
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11655777
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Filing Dt:
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01/19/2007
|
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Publication #:
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Pub Dt:
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08/16/2007
| | | | |
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Title:
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WAFER LEVEL CHIP PACKAGING
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Patent #:
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Issue Dt:
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02/24/2009
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Application #:
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11699852
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Filing Dt:
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01/30/2007
|
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Publication #:
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Pub Dt:
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06/21/2007
| | | | |
|
Title:
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METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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10/05/2010
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Application #:
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11789694
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Filing Dt:
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04/25/2007
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Publication #:
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Pub Dt:
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05/01/2008
| | | | |
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Title:
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WAFER-LEVEL FABRICATION OF LIDDED CHIPS WITH ELECTRODEPOSITED DIELECTRIC COATING
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Patent #:
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Issue Dt:
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01/05/2010
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Application #:
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11891867
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Filing Dt:
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08/13/2007
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Publication #:
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Pub Dt:
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01/17/2008
| | | | |
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Title:
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METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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01/20/2009
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Application #:
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11894473
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Filing Dt:
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08/21/2007
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Publication #:
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Pub Dt:
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01/24/2008
| | | | |
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Title:
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METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
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