Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 062467/0399 | |
| Pages: | 4 |
| | Recorded: | 01/24/2023 | | |
| Attorney Dkt #: | 0077527-000059 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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10554274
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Filing Dt:
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09/13/2006
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Publication #:
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Pub Dt:
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02/15/2007
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Title:
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Soldering material based on sn ag and cu
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Patent #:
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Issue Dt:
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06/20/2017
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Application #:
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12860497
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Filing Dt:
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08/20/2010
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Publication #:
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Pub Dt:
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02/23/2012
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Title:
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ORGANIC ACID- OR LATENT ORGANIC ACID-FUNCTIONALIZED POLYMER-COATED METAL POWDERS FOR SOLDER PASTES
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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13113716
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Filing Dt:
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05/23/2011
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Publication #:
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Pub Dt:
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11/03/2011
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Title:
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THERMALLY DECOMPOSABLE POLYMER COATED METAL POWDERS
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Patent #:
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Issue Dt:
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12/06/2016
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Application #:
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13530751
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Filing Dt:
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06/22/2012
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Publication #:
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Pub Dt:
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02/21/2013
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Title:
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SOLDER PASTE COMPOSITION, A SOLDER PASTE AND A SOLDERING FLUX
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Patent #:
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Issue Dt:
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08/30/2016
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Application #:
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14199179
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Filing Dt:
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03/06/2014
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Publication #:
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Pub Dt:
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07/03/2014
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Title:
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DI- OR POLY-FUNCTIONAL ELECTRON DEFICIENT OLEFINS COATED METAL POWDERS FOR SOLDER PASTE
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Patent #:
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Issue Dt:
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01/29/2019
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Application #:
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15599024
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Filing Dt:
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05/18/2017
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Publication #:
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Pub Dt:
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09/14/2017
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Title:
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ORGANIC ACID-OR LATENT ORGANIC ACID-FUNCTIONALIZED POLYMER-COATED METAL POWDERS FOR SOLDER PASTES
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Patent #:
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Issue Dt:
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03/29/2022
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Application #:
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16530053
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Filing Dt:
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08/02/2019
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Publication #:
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Pub Dt:
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01/23/2020
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Title:
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SOLDERING MATERIAL BASED ON SN AG AND CU
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17675103
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Filing Dt:
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02/18/2022
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Publication #:
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Pub Dt:
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06/02/2022
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Title:
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SOLDERING MATERIAL BASED ON SN AG AND CU
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Assignee
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| NIHONBASHI SAKURADORI BLDG. 5TH FLOOR |
| 3-8-4 NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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Correspondence name and address
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BUCHANAN INGERSOLL & ROONEY
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1737 KING STREET
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ALEXANDRIA, VA 22314
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