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NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	038378/0400			Pages:	9
		Recorded:	04/07/2016
Conveyance:	CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).

Total properties: 84

Patent #:	6660565	Issue Dt:	12/09/2003	Application #:	09640534	Filing Dt:	08/17/2000
Title:	FLIP CHIP MOLDED/EXPOSED DIE PROCESS AND PACKAGE STRUCTURE

Patent #:	6597188	Issue Dt:	07/22/2003	Application #:	09658890	Filing Dt:	09/11/2000
Title:	GROUND LAND FOR SINGULATED BALL GRID ARRAY

Patent #:	6544812	Issue Dt:	04/08/2003	Application #:	09706220	Filing Dt:	11/06/2000
Title:	SINGLE UNIT AUTOMATED ASSEMBLY OF FLEX ENHANCED BALL GRID ARRAY PACKAGES

Patent #:	6581278	Issue Dt:	06/24/2003	Application #:	09759904	Filing Dt:	01/16/2001
Publication #:	US20020093080	Pub Dt:	07/18/2002
Title:	PROCESS AND SUPPORT CARRIER FOR FLEXIBLE SUBSTRATES

Patent #:	6586925	Issue Dt:	07/01/2003	Application #:	09828677	Filing Dt:	04/09/2001
Publication #:	US20020145438	Pub Dt:	10/10/2002
Title:	METHOD AND APPARATUS FOR ESTABLISHING QUICK AND RELIABLE CONNECTION BETWEEN A SEMICONDUCTOR DEVICE HANDLER PLATE AND A SEMICONDUCTOR DEVICE TEST HEAD PLATE

Patent #:	6614123	Issue Dt:	09/02/2003	Application #:	09919763	Filing Dt:	07/31/2001
Publication #:	US20030025215	Pub Dt:	02/06/2003
Title:	PLASTIC BALL GRID ARRAY PACKAGE WITH INTEGRAL HEATSINK

Patent #:	6599779	Issue Dt:	07/29/2003	Application #:	09961555	Filing Dt:	09/24/2001
Publication #:	US20030057545	Pub Dt:	03/27/2003
Title:	PBGA SUBSTRATE FOR ANCHORING HEAT SINK

Patent #:	6617525	Issue Dt:	09/09/2003	Application #:	10043603	Filing Dt:	01/14/2002
Publication #:	US20020056570	Pub Dt:	05/16/2002
Title:	MOLDED STIFFENER FOR FLEXIBLE CIRCUIT MOLDING

Patent #:	6737298	Issue Dt:	05/18/2004	Application #:	10055094	Filing Dt:	01/23/2002
Publication #:	US20030138994	Pub Dt:	07/24/2003
Title:	HEAT SPREADER ANCHORING & GROUNDING METHOD & THERMALLY ENHANCED PBGA PACKAGE USING THE SAME

Patent #:	6630373	Issue Dt:	10/07/2003	Application #:	10083993	Filing Dt:	02/26/2002
Publication #:	US20030160309	Pub Dt:	08/28/2003
Title:	GROUND PLANE FOR EXPOSED PACKAGE

Patent #:	6750534	Issue Dt:	06/15/2004	Application #:	10099284	Filing Dt:	03/15/2002
Publication #:	US20020093095	Pub Dt:	07/18/2002
Title:	HEAT SPREADER HOLE PIN 1 IDENTIFIER

Patent #:	6706563	Issue Dt:	03/16/2004	Application #:	10119920	Filing Dt:	04/10/2002
Publication #:	US20030197195	Pub Dt:	10/23/2003
Title:	HEAT SPREADER INTERCONNECT METHODOLOGY FOR THERMALLY ENHANCED PBGA PACKAGES

Patent #:	6791346	Issue Dt:	09/14/2004	Application #:	10140573	Filing Dt:	05/08/2002
Publication #:	US20020125909	Pub Dt:	09/12/2002
Title:	TESTING OF BGA AND OTHER CSP PACKAGES USING PROBING TECHNIQUES

Patent #:	6740577	Issue Dt:	05/25/2004	Application #:	10151977	Filing Dt:	05/21/2002
Publication #:	US20030219966	Pub Dt:	11/27/2003
Title:	A METHOD OF FORMING A SMALL PITCH TORCH BUMP FOR MOUNTING HIGH-PERFORMANCE FLIP-FLOP DEVICES

Patent #:	6774640	Issue Dt:	08/10/2004	Application #:	10224151	Filing Dt:	08/20/2002
Publication #:	US20040036068	Pub Dt:	02/26/2004
Title:	TEST COUPON PATTERN DESIGN TO CONTROL MULTILAYER SAW SINGULATED PLASTIC BALL GRID ARRAY SUBSTRATE MIS-REGISTRATION

Patent #:	6834658	Issue Dt:	12/28/2004	Application #:	10236579	Filing Dt:	09/06/2002
Publication #:	US20030024548	Pub Dt:	02/06/2003
Title:	PBGA SINGULATED SUBSTRATE FOR MODEL MELAMINE CLEANING

Patent #:	6686258	Issue Dt:	02/03/2004	Application #:	10236650	Filing Dt:	09/06/2002
Publication #:	US20030011006	Pub Dt:	01/16/2003
Title:	METHOD OF TRIMMING AND SINGULATING LEADED SEMICONDUCTOR PACKAGES

Patent #:	6855573	Issue Dt:	02/15/2005	Application #:	10251231	Filing Dt:	09/19/2002
Publication #:	US20040058477	Pub Dt:	03/25/2004
Title:	INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREFOR

Patent #:	6841858	Issue Dt:	01/11/2005	Application #:	10256407	Filing Dt:	09/27/2002
Publication #:	US20040061202	Pub Dt:	04/01/2004
Title:	LEADFRAME FOR DIE STACKING APPLICATIONS AND RELATED DIE STACKING CONCEPTS

Patent #:	6802445	Issue Dt:	10/12/2004	Application #:	10279900	Filing Dt:	10/24/2002
Publication #:	US20040079788	Pub Dt:	04/29/2004
Title:	COST EFFECTIVE SUBSTRATE FABRICATION FOR FLIP-CHIP PACKAGES

Patent #:	6825067	Issue Dt:	11/30/2004	Application #:	10315533	Filing Dt:	12/10/2002
Publication #:	US20040108601	Pub Dt:	06/10/2004
Title:	MOLD CAP ANCHORING METHOD FOR MOLDED FLEX BGA PACKAGES

Patent #:	6828671	Issue Dt:	12/07/2004	Application #:	10323447	Filing Dt:	12/19/2002
Publication #:	US20030085462	Pub Dt:	05/08/2003
Title:	ENHANCED BGA GROUNDED HEATSINK

Patent #:	6744125	Issue Dt:	06/01/2004	Application #:	10339158	Filing Dt:	01/09/2003
Publication #:	US20030143777	Pub Dt:	07/31/2003
Title:	SUPER THIN/SUPER THERMAL BALL GRID ARRAY PACKAGE

Patent #:	6627990	Issue Dt:	09/30/2003	Application #:	10359407	Filing Dt:	02/06/2003
Title:	THERMALLY ENHANCED STACKED DIE PACKAGE

Patent #:	6759752	Issue Dt:	07/06/2004	Application #:	10371515	Filing Dt:	02/20/2003
Publication #:	US20030151148	Pub Dt:	08/14/2003
Title:	SINGLE UNIT AUTOMATED ASSEMBLY OF FLEX ENHANCED BALL GRID ARRAY PACKAGES

Patent #:	6775140	Issue Dt:	08/10/2004	Application #:	10434256	Filing Dt:	05/07/2003
Publication #:	US20040075987	Pub Dt:	04/22/2004
Title:	HEAT SPREADERS, HEAT SPREADER PACKAGES, AND FABRICATION METHODS FOR USE WITH FLIP CHIP SEMICONDUCTOR DEVICES

Patent #:	7064420	Issue Dt:	06/20/2006	Application #:	10444849	Filing Dt:	05/23/2003
Publication #:	US20040061204	Pub Dt:	04/01/2004
Title:	INTEGRATED CIRCUIT LEADFRAME WITH GROUND PLANE

Patent #:	7135760	Issue Dt:	11/14/2006	Application #:	10446275	Filing Dt:	05/23/2003
Publication #:	US20040061205	Pub Dt:	04/01/2004
Title:	MOISTURE RESISTANT INTEGRATED CIRCUIT LEADFRAME PACKAGE

Patent #:	6876069	Issue Dt:	04/05/2005	Application #:	10462264	Filing Dt:	06/16/2003
Publication #:	US20040070055	Pub Dt:	04/15/2004
Title:	GROUND PLANE FOR EXPOSED PACKAGE

Patent #:	7446408	Issue Dt:	11/04/2008	Application #:	10462288	Filing Dt:	06/16/2003
Publication #:	US20030216024	Pub Dt:	11/20/2003
Title:	SEMICONDUCTOR PACKAGE WITH HEAT SINK

Patent #:	6833287	Issue Dt:	12/21/2004	Application #:	10463007	Filing Dt:	06/16/2003
Publication #:	US20040251526	Pub Dt:	12/16/2004
Title:	SYSTEM FOR SEMICONDUCTOR PACKAGE WITH STACKED DIES

Patent #:	6927479	Issue Dt:	08/09/2005	Application #:	10606429	Filing Dt:	06/25/2003
Publication #:	US20040262718	Pub Dt:	12/30/2004
Title:	METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE FOR A DIE LARGER THAN A DIE PAD

Patent #:	6861288	Issue Dt:	03/01/2005	Application #:	10676736	Filing Dt:	09/30/2003
Publication #:	US20040145039	Pub Dt:	07/29/2004
Title:	STACKED SEMICONDUCTOR PACKAGES AND METHOD FOR THE FABRICATION THEREOF

Patent #:	7061088	Issue Dt:	06/13/2006	Application #:	10681572	Filing Dt:	10/08/2003
Publication #:	US20040113253	Pub Dt:	06/17/2004
Title:	SEMICONDUCTOR STACKED MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE

Patent #:	7057269	Issue Dt:	06/06/2006	Application #:	10681735	Filing Dt:	10/08/2003
Publication #:	US20040119153	Pub Dt:	06/24/2004
Title:	SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED LAND GRID ARRAY (LGA) PACKAGE STACKED OVER BALL GRID ARRAY (BGA) PACKAGE

Patent #:	6858470	Issue Dt:	02/22/2005	Application #:	10682273	Filing Dt:	10/08/2003
Title:	METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES, AND LEADFRAME ASSEMBLIES FOR THE FABRICATION THEREOF

Patent #:	7081668	Issue Dt:	07/25/2006	Application #:	10693217	Filing Dt:	10/24/2003
Publication #:	US20040084688	Pub Dt:	05/06/2004
Title:	FLIP CHIP MOLDED/EXPOSED DIE PROCESS AND PACKAGE STRUCTURE

Patent #:	7076861	Issue Dt:	07/18/2006	Application #:	10745149	Filing Dt:	12/22/2003
Publication #:	US20040134054	Pub Dt:	07/15/2004
Title:	MULTI-PACKAGE CONVERSION KIT FOR A PICK AND PLACE HANDLER

Patent #:	6818981	Issue Dt:	11/16/2004	Application #:	10765644	Filing Dt:	01/26/2004
Publication #:	US20040155338	Pub Dt:	08/12/2004
Title:	HEAT SPREADER INTERCONNECT FOR THERMALLY ENHANCED PBGA PACKAGES

Patent #:	7153725	Issue Dt:	12/26/2006	Application #:	10766746	Filing Dt:	01/27/2004
Publication #:	US20050161780	Pub Dt:	07/28/2005
Title:	STRIP-FABRICATED FLIP CHIP IN PACKAGE AND FLIP CHIP IN SYSTEM HEAT SPREADER ASSEMBLIES AND FABRICATION METHODS THEREFOR

Patent #:	7005325	Issue Dt:	02/28/2006	Application #:	10773716	Filing Dt:	02/05/2004
Publication #:	US20050173783	Pub Dt:	08/11/2005
Title:	SEMICONDUCTOR PACKAGE WITH PASSIVE DEVICE INTEGRATION

Patent #:	6875634	Issue Dt:	04/05/2005	Application #:	10804732	Filing Dt:	03/18/2004
Publication #:	US20040180525	Pub Dt:	09/16/2004
Title:	HEAT SPREADER ANCHORING AND GROUNDING METHOD AND THERMALLY ENHANCED PBGA PACKAGE USING THE SAME

Patent #:	7306133	Issue Dt:	12/11/2007	Application #:	10825810	Filing Dt:	04/16/2004
Publication #:	US20040211817	Pub Dt:	10/28/2004
Title:	SYSTEM FOR FABRICATING AN INTEGRATED CIRCUIT PACKAGE ON A PRINTED CIRCUIT BOARD

Patent #:	7205651	Issue Dt:	04/17/2007	Application #:	10825910	Filing Dt:	04/16/2004
Publication #:	US20050230800	Pub Dt:	10/20/2005
Title:	THERMALLY ENHANCED STACKED DIE PACKAGE AND FABRICATION METHOD

Patent #:	7327025	Issue Dt:	02/05/2008	Application #:	10836916	Filing Dt:	04/30/2004
Publication #:	US20050242428	Pub Dt:	11/03/2005
Title:	HEAT SPREADER FOR THERMALLY ENHANCED SEMICONDUCTOR PACKAGE

Patent #:	7129569	Issue Dt:	10/31/2006	Application #:	10837347	Filing Dt:	04/30/2004
Publication #:	US20050253230	Pub Dt:	11/17/2005
Title:	LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR

Patent #:	7060536	Issue Dt:	06/13/2006	Application #:	10846171	Filing Dt:	05/13/2004
Publication #:	US20050260787	Pub Dt:	11/24/2005
Title:	DUAL ROW LEADFRAME AND FABRICATION METHOD

Patent #:	7005370	Issue Dt:	02/28/2006	Application #:	10846176	Filing Dt:	05/13/2004
Publication #:	US20050253262	Pub Dt:	11/17/2005
Title:	METHOD OF MANUFACTURING DIFFERENT BOND PADS ON THE SAME SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE

Patent #:	7217599	Issue Dt:	05/15/2007	Application #:	10850220	Filing Dt:	05/19/2004
Publication #:	US20040253763	Pub Dt:	12/16/2004
Title:	INTEGRATED CIRCUIT PACKAGE WITH LEADFRAME LOCKED ENCAPSULATION AND METHOD OF MANUFACTURE THEREFOR

Patent #:	7091469	Issue Dt:	08/15/2006	Application #:	10850934	Filing Dt:	05/20/2004
Publication #:	US20050258216	Pub Dt:	11/24/2005
Title:	PACKAGING FOR OPTOELECTRONIC DEVICES

Patent #:	7008820	Issue Dt:	03/07/2006	Application #:	10866561	Filing Dt:	06/10/2004
Publication #:	US20050277227	Pub Dt:	12/15/2005
Title:	CHIP SCALE PACKAGE WITH OPEN SUBSTRATE

Patent #:	7242101	Issue Dt:	07/10/2007	Application #:	10894561	Filing Dt:	07/19/2004
Publication #:	US20060012022	Pub Dt:	01/19/2006
Title:	INTEGRATED CIRCUIT DIE WITH PEDESTAL

Patent #:	7381593	Issue Dt:	06/03/2008	Application #:	10913806	Filing Dt:	08/05/2004
Publication #:	US20060027902	Pub Dt:	02/09/2006
Title:	METHOD AND APPARATUS FOR STACKED DIE PACKAGING

Patent #:	6960493	Issue Dt:	11/01/2005	Application #:	10914870	Filing Dt:	08/09/2004
Publication #:	US20050006668	Pub Dt:	01/13/2005
Title:	SEMICONDUCTOR DEVICE PACKAGE

Patent #:	7863730	Issue Dt:	01/04/2011	Application #:	10921377	Filing Dt:	08/18/2004
Publication #:	US20050046015	Pub Dt:	03/03/2005
Title:	ARRAY-MOLDED PACKAGE HEAT SPREADER AND FABRICATION METHOD THEREFOR

Patent #:	6979907	Issue Dt:	12/27/2005	Application #:	10969361	Filing Dt:	10/19/2004
Publication #:	US20050051907	Pub Dt:	03/10/2005
Title:	INTEGRATED CIRCUIT PACKAGE

Patent #:	7309913	Issue Dt:	12/18/2007	Application #:	10986510	Filing Dt:	11/10/2004
Publication #:	US20050090050	Pub Dt:	04/28/2005
Title:	STACKED SEMICONDUCTOR PACKAGES

Patent #:	7091596	Issue Dt:	08/15/2006	Application #:	10993526	Filing Dt:	11/18/2004
Publication #:	US20050087846	Pub Dt:	04/28/2005
Title:	SEMICONDUCTOR PACKAGES AND LEADFRAME ASSEMBLIES

Patent #:	7253511	Issue Dt:	08/07/2007	Application #:	11022375	Filing Dt:	12/23/2004
Publication #:	US20060012018	Pub Dt:	01/19/2006
Title:	SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE

Patent #:	7626277	Issue Dt:	12/01/2009	Application #:	11164329	Filing Dt:	11/18/2005
Publication #:	US20060055009	Pub Dt:	03/16/2006
Title:	INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE

Patent #:	7595551	Issue Dt:	09/29/2009	Application #:	11169850	Filing Dt:	06/28/2005
Publication #:	US20050236702	Pub Dt:	10/27/2005
Title:	SEMICONDUCTOR PACKAGE FOR A LARGE DIE

Patent #:	7443039	Issue Dt:	10/28/2008	Application #:	11306352	Filing Dt:	12/23/2005
Publication #:	US20060197223	Pub Dt:	09/07/2006
Title:	SYSTEM FOR DIFFERENT BOND PADS IN AN INTEGRATED CIRCUIT PACKAGE

Patent #:	7960816	Issue Dt:	06/14/2011	Application #:	11306354	Filing Dt:	12/23/2005
Publication #:	US20060197198	Pub Dt:	09/07/2006
Title:	SEMICONDUCTOR PACKAGE WITH PASSIVE DEVICE INTEGRATION

Patent #:	7166494	Issue Dt:	01/23/2007	Application #:	11372988	Filing Dt:	03/10/2006
Publication #:	US20060172461	Pub Dt:	08/03/2006
Title:	METHOD OF FABRICATING A SEMICONDUCTOR STACKED MULIT-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE

Patent #:	7169642	Issue Dt:	01/30/2007	Application #:	11374378	Filing Dt:	03/13/2006
Publication #:	US20060172462	Pub Dt:	08/03/2006
Title:	METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED LAND GRID ARRAY (LGA) PACKAGE STACKED OVER BALL GRID ARRAY (BGA) PACKAGE

Patent #:	7339258	Issue Dt:	03/04/2008	Application #:	11379740	Filing Dt:	04/21/2006
Publication #:	US20060186515	Pub Dt:	08/24/2006
Title:	DUAL ROW LEADFRAME AND FABRICATION METHOD

Patent #:	7545032	Issue Dt:	06/09/2009	Application #:	11456544	Filing Dt:	07/10/2006
Publication #:	US20080006926	Pub Dt:	01/10/2008
Title:	INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STIFFENER

Patent #:	7700404	Issue Dt:	04/20/2010	Application #:	11536544	Filing Dt:	09/28/2006
Publication #:	US20070018290	Pub Dt:	01/25/2007
Title:	LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR

Patent #:	7364946	Issue Dt:	04/29/2008	Application #:	11626272	Filing Dt:	01/23/2007
Publication #:	US20070117267	Pub Dt:	05/24/2007
Title:	METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED LAND GRID ARRAY (LGA) PACKAGE STACKED OVER BALL GRID ARRAY (BGA) PACKAGE

Patent #:	7413933	Issue Dt:	08/19/2008	Application #:	11697779	Filing Dt:	04/09/2007
Publication #:	US20070190694	Pub Dt:	08/16/2007
Title:	INTEGRATED CIRCUIT PACKAGE WITH LEADFRAME LOCKED ENCAPSULATION AND METHOD OF MANUFACTURE THEREFOR

Patent #:	7786593	Issue Dt:	08/31/2010	Application #:	11760690	Filing Dt:	06/08/2007
Publication #:	US20070228538	Pub Dt:	10/04/2007
Title:	INTEGRATED CIRCUIT DIE WITH PEDESTAL

Patent #:	7692279	Issue Dt:	04/06/2010	Application #:	11772776	Filing Dt:	07/02/2007
Publication #:	US20070278658	Pub Dt:	12/06/2007
Title:	SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE

Patent #:	7679177	Issue Dt:	03/16/2010	Application #:	11859462	Filing Dt:	09/21/2007
Publication #:	US20090079066	Pub Dt:	03/26/2009
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PASSIVE COMPONENTS

Patent #:	7679169	Issue Dt:	03/16/2010	Application #:	12236227	Filing Dt:	09/23/2008
Publication #:	US20090026597	Pub Dt:	01/29/2009
Title:	STACKED INTEGRATED CIRCUIT LEADFRAME PACKAGE SYSTEM

Patent #:	8810015	Issue Dt:	08/19/2014	Application #:	12484245	Filing Dt:	06/14/2009
Publication #:	US20100314731	Pub Dt:	12/16/2010
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HIGH LEAD COUNT AND METHOD OF MANUFACTURE THEREOF

Patent #:	8207598	Issue Dt:	06/26/2012	Application #:	12498163	Filing Dt:	07/06/2009
Publication #:	US20090273062	Pub Dt:	11/05/2009
Title:	SEMICONDUCTOR PACKAGE HEAT SPREADER

Patent #:	8030783	Issue Dt:	10/04/2011	Application #:	12582587	Filing Dt:	10/20/2009
Publication #:	US20100038771	Pub Dt:	02/18/2010
Title:	INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE

Patent #:	9093392	Issue Dt:	07/28/2015	Application #:	12965018	Filing Dt:	12/10/2010
Publication #:	US20120146229	Pub Dt:	06/14/2012
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF

Patent #:	8129263	Issue Dt:	03/06/2012	Application #:	13178331	Filing Dt:	07/07/2011
Publication #:	US20110266700	Pub Dt:	11/03/2011
Title:	WIRE BOND INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF

Patent #:	8482109	Issue Dt:	07/09/2013	Application #:	13241141	Filing Dt:	09/22/2011
Publication #:	US20130075883	Pub Dt:	03/28/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL CONNECTION AND METHOD OF MANUFACTURE THEREOF

Patent #:	9034693	Issue Dt:	05/19/2015	Application #:	13247890	Filing Dt:	09/28/2011
Publication #:	US20120018886	Pub Dt:	01/26/2012
Title:	INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE AND METHOD OF MANUFACTURING THEREOF

Patent #:	9093415	Issue Dt:	07/28/2015	Application #:	14037110	Filing Dt:	09/25/2013
Publication #:	US20150084178	Pub Dt:	03/26/2015
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD OF MANUFACTURE THEREOF

Patent #:	9105620	Issue Dt:	08/11/2015	Application #:	14038577	Filing Dt:	09/26/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE TRACES AND METHOD OF MANUFACTURE THEREOF

Patent #:	9093278	Issue Dt:	07/28/2015	Application #:	14137352	Filing Dt:	12/20/2013
Title:	METHOD OF MANUFACTURE OF INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLASMA PROCESSING

Assignor

STATS CHIPPAC LTD.

Exec Dt:

03/29/2016

Assignee

STATS CHIPPAC PTE. LTE.

5 YISHUN STREET 23

SINGAP[ORE, SINGAPORE

Correspondence name and address
	EDWARD J. MAYLE
	1850 K STREET, N.W.
	SUITE 1100
	WASHINGTON, DE 20006

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