Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 026497/0414 | |
| Pages: | 4 |
| | Recorded: | 06/24/2011 | | |
| Attorney Dkt #: | 0120168 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13168605
|
Filing Dt:
|
06/24/2011
|
|
Publication #:
|
|
Pub Dt:
|
12/27/2012
| | | | |
|
Title:
|
Externally Wire Bondable Chip Scale Package in a System-in-Package Module
|
|
|
Assignee
|
|
|
|
|
| 4000 MACARTHUR BOULEVARD |
| NEWPORT BEACH, CALIFORNIA 92660 |
|
|
Correspondence name and address
|
| |
FARSHAD FARJAMI
|
| |
26522 LA ALAMEDA AVE., SUITE 360
|
| |
MISSION VIEJO, CA 92691
|
Search Results as of:
05/23/2024 04:01 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
