Patent Assignment Details
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| Reel/Frame: | 012582/0424 | |
| Pages: | 3 |
| | Recorded: | 02/07/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/10/2004
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Application #:
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10067338
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Filing Dt:
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02/07/2002
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Publication #:
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Pub Dt:
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10/17/2002
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Title:
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LEAD-FREE SOLDER AND SOLDER JOINT
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Assignee
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| 65, MIDORIGAOKA 3-CHOME |
| TOYOTA-SHI, AICHI 471-8502, JAPAN |
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Correspondence name and address
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ARMSTRONG, WESTERMAN & HATTORI, LLP
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STEPHEN G. ADRIAN
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1725 K STREET, N.W.
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SUITE 1000
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WASHINGTON, DC 20006
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