Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 022162/0428 | |
| Pages: | 9 |
| | Recorded: | 01/28/2009 | | |
| Attorney Dkt #: | 5807.019 |
| Conveyance: | SECURITY AGREEMENT |
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Total properties:
3
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Patent #:
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Issue Dt:
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06/07/1994
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Application #:
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07934258
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Filing Dt:
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08/25/1992
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Title:
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AUTOMATIC WIRE DE-SPOOLER FOR WIRE BONDING MACHINES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11323444
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Filing Dt:
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12/30/2005
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Publication #:
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Pub Dt:
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07/05/2007
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Title:
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Solder deposit method on electronic packages for post-connection process
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Patent #:
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Issue Dt:
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05/24/2011
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Application #:
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11523895
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Filing Dt:
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09/19/2006
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Publication #:
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Pub Dt:
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07/05/2007
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Title:
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METHOD FOR DEPOSITING SOLDER MATERIAL ON AN ELECTRONIC COMPONENT PART USING SEPARATORS
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Assignee
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| 111 SOUTH WACKER DRIVE |
| SUITE 5050 |
| CHICAGO, ILLINOIS 60606 |
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Correspondence name and address
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SARAH ENDRES
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C/O GOLDBERG KOHN, 55 E. MONROE ST.
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STE. 3300
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CHICAGO, IL 60603
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