Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021953/0432 | |
| Pages: | 4 |
| | Recorded: | 12/09/2008 | | |
| Attorney Dkt #: | MR1957-1802 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12243246
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Filing Dt:
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10/01/2008
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Publication #:
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Pub Dt:
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11/19/2009
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Title:
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SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-DOWN ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
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Assignee
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| NO. 18, LANE 522 |
| SEC. 5. JHONGHUA RD. |
| HSINCHU CITY, TAIWAN R.O.C. |
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Correspondence name and address
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MORTON J. ROSENBERG
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE
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SUITE 101
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ELLICOTT CITY, MD 21043
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