Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051703/0433 | |
| Pages: | 5 |
| | Recorded: | 02/03/2020 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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01/20/2004
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Application #:
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10265751
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Filing Dt:
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10/07/2002
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Title:
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MULTI CHIP MODULE
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Patent #:
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Issue Dt:
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11/08/2005
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Application #:
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10464178
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Filing Dt:
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06/18/2003
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Title:
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MULTI-CHIP PACKAGE HAVING A CONTIGUOUS HEAT SPREADER ASSEMBLY
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Patent #:
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Issue Dt:
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02/22/2005
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Application #:
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10638772
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Filing Dt:
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08/11/2003
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Publication #:
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Pub Dt:
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04/08/2004
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Title:
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MULTI CHIP MODULE
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Patent #:
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Issue Dt:
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10/19/2010
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Application #:
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11403492
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Filing Dt:
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04/13/2006
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Publication #:
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Pub Dt:
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09/21/2006
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Title:
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METHOD AND APPARATUS FOR IMPROVING THERMAL ENERGY DISSIPATION IN A DIRECT-CHIP-ATTACH COUPLING CONFIGURATION OF AN INTEGRATED CIRCUIT AND A CIRCUIT BOARD
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Assignee
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| 401 N. MICHIGAN AVE. |
| CHICAGO, ILLINOIS 60611 |
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Correspondence name and address
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CHAD HILYARD
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401 N. MICHIGAN AVE.
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SUITE 1630
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CHICAGO, IL 60611
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