Patent Assignment Details
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Reel/Frame: | 047919/0441 | |
| Pages: | 3 |
| | Recorded: | 01/07/2019 | | |
Attorney Dkt #: | 101-16000US/AB2075US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/17/2022
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Application #:
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16233431
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Filing Dt:
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12/27/2018
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Publication #:
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Pub Dt:
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05/23/2019
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Title:
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Scalable Micro Bumps Indexing and Redundancy Scheme for Homogeneous Configurable Integrated Circuit Dies
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Assignee
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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INVENTIQ LEGAL LLP/INTEL CORP.
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P.O. BOX 779
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MENLO PARK, CA 94026-0779
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05/24/2024 05:34 AM
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