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Reel/Frame:057962/0460   Pages: 5
Recorded: 10/28/2021
Attorney Dkt #:5308-1 N/C TO WOLFSPEED
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 11
1
Patent #:
Issue Dt:
11/02/2010
Application #:
11716317
Filing Dt:
03/09/2007
Publication #:
Pub Dt:
09/11/2008
Title:
NITRIDE SEMICONDUCTOR STRUCTURES WITH INTERLAYER STRUCTURES
2
Patent #:
Issue Dt:
07/16/2019
Application #:
15613328
Filing Dt:
06/22/2017
Publication #:
Pub Dt:
12/28/2017
Title:
DEPLETION MODE SEMICONDUCTOR DEVICES INCLUDING CURRENT DEPENDENT RESISTANCE
3
Patent #:
Issue Dt:
02/08/2022
Application #:
16502771
Filing Dt:
07/03/2019
Publication #:
Pub Dt:
10/31/2019
Title:
DEPLETION MODE SEMICONDUCTOR DEVICES INCLUDING CURRENT DEPENDENT RESISTANCE
4
Patent #:
Issue Dt:
05/23/2023
Application #:
17325576
Filing Dt:
05/20/2021
Publication #:
Pub Dt:
04/28/2022
Title:
FIELD EFFECT TRANSISTOR WITH ENHANCED RELIABILITY
5
Patent #:
NONE
Issue Dt:
Application #:
17325610
Filing Dt:
05/20/2021
Publication #:
Pub Dt:
11/24/2022
Title:
FIELD EFFECT TRANSISTOR WITH SELECTIVE CHANNEL LAYER DOPING
6
Patent #:
Issue Dt:
01/09/2024
Application #:
17325635
Filing Dt:
05/20/2021
Publication #:
Pub Dt:
11/24/2022
Title:
FIELD EFFECT TRANSISTORS WITH MODIFIED ACCESS REGIONS
7
Patent #:
NONE
Issue Dt:
Application #:
17325643
Filing Dt:
05/20/2021
Publication #:
Pub Dt:
11/24/2022
Title:
FIELD EFFECT TRANSISTOR WITH SELECTIVE MODIFIED ACCESS REGIONS
8
Patent #:
Issue Dt:
09/05/2023
Application #:
17325666
Filing Dt:
05/20/2021
Publication #:
Pub Dt:
04/28/2022
Title:
FIELD EFFECT TRANSISTOR WITH SOURCE-CONNECTED FIELD PLATE
9
Patent #:
Issue Dt:
04/04/2023
Application #:
17395035
Filing Dt:
08/05/2021
Publication #:
Pub Dt:
02/09/2023
Title:
COMPENSATION OF TRAPPING IN FIELD EFFECT TRANSISTORS
10
Patent #:
NONE
Issue Dt:
Application #:
17503733
Filing Dt:
10/18/2021
Publication #:
Pub Dt:
04/20/2023
Title:
TRANSISTOR DEVICE STRUCTURE WITH ANGLED WIRE BONDS
11
Patent #:
NONE
Issue Dt:
06/11/2024
Application #:
17504284
Filing Dt:
10/18/2021
Publication #:
Pub Dt:
04/20/2023
Title:
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FOR SEMICONDUCTOR DEVICE PACKAGES
Assignor
1
Exec Dt:
10/01/2021
Assignee
1
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondence name and address
SAGE PATENT GROUP
PO BOX 30789
RALEIGH, NC 27622-0789

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