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Reel/Frame:034233/0481   Pages: 6
Recorded: 11/21/2014
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 37
1
Patent #:
5672239
Issue Dt:
09/30/1997
Application #:
08438261
Filing Dt:
05/10/1995
Title:
INTEGRATED SEMICONDUCTOR WAFER PROCESSING SYSTEM
2
Patent #:
5985089
Issue Dt:
11/16/1999
Application #:
08450369
Filing Dt:
05/25/1995
Title:
PLASMA ETCH SYSTEM
3
Patent #:
6605198
Issue Dt:
08/12/2003
Application #:
08564659
Filing Dt:
11/29/1995
Title:
APPARATUS FOR, AND METHOD OF, DEPOSITING A FILM ON A SUBSTRATE
4
Patent #:
5914017
Issue Dt:
06/22/1999
Application #:
08651377
Filing Dt:
05/22/1996
Title:
APPARATUS FOR, AND METHOD OF, REMOVING HYDROCARBONS FROM THE SURFACE OF A SUBSTRATE
5
Patent #:
6048435
Issue Dt:
04/11/2000
Application #:
08675093
Filing Dt:
07/03/1996
Title:
PLASMA ETCH REACTOR AND METHOD FOR EMERGING FILMS
6
Patent #:
6500314
Issue Dt:
12/31/2002
Application #:
08675559
Filing Dt:
07/03/1996
Title:
PLASMA ETCH REACTOR AND METHOD
7
Patent #:
6086947
Issue Dt:
07/11/2000
Application #:
08729015
Filing Dt:
10/10/1996
Title:
METHOD OF DEPOSITING MATERIALS ON A WAFER TO ELIMINATE THE EFFECT OF CRACKS IN THE DEPOSITION
8
Patent #:
6127277
Issue Dt:
10/03/2000
Application #:
08742861
Filing Dt:
11/01/1996
Title:
METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR WAFER WITH FEATURES HAVING VERTICAL SIDEWALLS
9
Patent #:
5958139
Issue Dt:
09/28/1999
Application #:
08850224
Filing Dt:
05/02/1997
Title:
PLASMA ETCH SYSTEM
10
Patent #:
6046116
Issue Dt:
04/04/2000
Application #:
08974089
Filing Dt:
11/19/1997
Title:
A METHOD FOR MINIMIZING THE CRITICAL DIMENSION GROWTH OF A FEATURE ON A SEMICONDUCTOR WAFER
11
Patent #:
6346428
Issue Dt:
02/12/2002
Application #:
09135210
Filing Dt:
08/17/1998
Title:
METHOD AND APPARATUS FOR MINIMIZING SEMICONDUCTOR WAFER ARCING DURING SEMICONDUCTOR WAFER PROCESSING
12
Patent #:
6354240
Issue Dt:
03/12/2002
Application #:
09152238
Filing Dt:
09/11/1998
Title:
PLASMA ETCH REACTOR HAVING A PLURALITY OF MAGNETS (AS AMENDED)
13
Patent #:
6190496
Issue Dt:
02/20/2001
Application #:
09384614
Filing Dt:
08/27/1999
Title:
PLASMA ETCH REACTOR AND METHOD FOR EMERGING FILMS
14
Patent #:
6410448
Issue Dt:
06/25/2002
Application #:
09384858
Filing Dt:
08/27/1999
Title:
PLASMA ETCH REACTOR AND METHOD FOR EMERGING FILMS
15
Patent #:
6120610
Issue Dt:
09/19/2000
Application #:
09412873
Filing Dt:
10/05/1999
Title:
PLASMA ETCH SYSTEM
16
Patent #:
6486069
Issue Dt:
11/26/2002
Application #:
09454814
Filing Dt:
12/03/1999
Title:
COBALT SILICIDE ETCH PROCESS AND APPARATUS
17
Patent #:
6620335
Issue Dt:
09/16/2003
Application #:
09455641
Filing Dt:
12/07/1999
Title:
PLASMA ETCH REACTOR AND METHOD
18
Patent #:
6492280
Issue Dt:
12/10/2002
Application #:
09517387
Filing Dt:
03/02/2000
Title:
METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR WAFER WITH FEATURES HAVING VERTICAL SIDEWALLS
19
Patent #:
6235656
Issue Dt:
05/22/2001
Application #:
09609733
Filing Dt:
07/03/2000
Title:
Dual degas/cool loadlock cluster tool
20
Patent #:
6406925
Issue Dt:
06/18/2002
Application #:
09712707
Filing Dt:
11/14/2000
Title:
METHOD AND APPARATUS FOR MINIMIZING SEMICONDUCTOR WAFER ARCING DURING SEMICONDUCTOR WAFER PROCESSING
21
Patent #:
6562141
Issue Dt:
05/13/2003
Application #:
09798048
Filing Dt:
03/05/2001
Publication #:
US20020000194
Pub Dt:
01/03/2002
Title:
DUAL DEGAS/COOL LOADLOCK CLUSTER TOOL
22
Patent #:
7467598
Issue Dt:
12/23/2008
Application #:
09829587
Filing Dt:
04/09/2001
Publication #:
US20030017709
Pub Dt:
01/23/2003
Title:
SYSTEM FOR, AND METHOD OF, ETCHING A SURFACE ON A WAFER
23
Patent #:
6774046
Issue Dt:
08/10/2004
Application #:
09880584
Filing Dt:
06/13/2001
Publication #:
US20010031561
Pub Dt:
10/18/2001
Title:
METHOD FOR MINIMIZING THE CRITICAL DIMENSION GROWTH OF A FEATURE ON A SEMICONDUCTOR WAFER
24
Patent #:
7439188
Issue Dt:
10/21/2008
Application #:
09888365
Filing Dt:
06/22/2001
Publication #:
US20020036064
Pub Dt:
03/28/2002
Title:
REACTOR WITH HEATED AND TEXTURED ELECTRODES AND SURFACES
25
Patent #:
6783638
Issue Dt:
08/31/2004
Application #:
09949181
Filing Dt:
09/07/2001
Publication #:
US20030047443
Pub Dt:
03/13/2003
Title:
FLAT MAGNETRON
26
Patent #:
7208396
Issue Dt:
04/24/2007
Application #:
10051886
Filing Dt:
01/16/2002
Publication #:
US20030132524
Pub Dt:
07/17/2003
Title:
PERMANENT ADHERENCE OF THE BACK END OF A WAFER TO AN ELECTRICAL COMPONENT OR SUB-ASSEMBLY
27
Patent #:
6905969
Issue Dt:
06/14/2005
Application #:
10156478
Filing Dt:
05/28/2002
Publication #:
US20020139665
Pub Dt:
10/03/2002
Title:
PLASMA ETCH REACTOR AND METHOD
28
Patent #:
6830664
Issue Dt:
12/14/2004
Application #:
10212293
Filing Dt:
08/05/2002
Publication #:
US20040060817
Pub Dt:
04/01/2004
Title:
CLUSTER TOOL WITH A HOLLOW CATHODE ARRAY
29
Patent #:
6824653
Issue Dt:
11/30/2004
Application #:
10371463
Filing Dt:
02/21/2003
Publication #:
US20040163944
Pub Dt:
08/26/2004
Title:
MAGNETRON WITH CONTROLLED DC POWER
30
Patent #:
NONE
Issue Dt:
Application #:
10371862
Filing Dt:
02/21/2003
Publication #:
US20040163952
Pub Dt:
08/26/2004
Title:
Magnetron with adjustable target positioning
31
Patent #:
7179350
Issue Dt:
02/20/2007
Application #:
10446005
Filing Dt:
05/23/2003
Publication #:
US20040231972
Pub Dt:
11/25/2004
Title:
REACTIVE SPUTTERING OF SILICON NITRIDE FILMS BY RF SUPPORTED DC MAGNETRON
32
Patent #:
7270729
Issue Dt:
09/18/2007
Application #:
10633839
Filing Dt:
08/04/2003
Publication #:
US20040038548
Pub Dt:
02/26/2004
Title:
SYSTEM FOR, AND METHOD OF, ETCHING A SURFACE ON A WAFER
33
Patent #:
7169623
Issue Dt:
01/30/2007
Application #:
10937660
Filing Dt:
09/09/2004
Publication #:
US20060051881
Pub Dt:
03/09/2006
Title:
SYSTEM AND METHOD FOR PROCESSING A WAFER INCLUDING STOP-ON-ALUMINA PROCESSING
34
Patent #:
7223699
Issue Dt:
05/29/2007
Application #:
11087540
Filing Dt:
03/23/2005
Publication #:
US20050164513
Pub Dt:
07/28/2005
Title:
PLASMA ETCH REACTOR AND METHOD
35
Patent #:
7645618
Issue Dt:
01/12/2010
Application #:
11724556
Filing Dt:
03/14/2007
Publication #:
US20070155027
Pub Dt:
07/05/2007
Title:
DRY ETCH STOP PROCESS FOR ELIMINATING ELECTRICAL SHORTING IN MRAM DEVICE STRUCTURES
36
Patent #:
NONE
Issue Dt:
Application #:
12203022
Filing Dt:
09/02/2008
Publication #:
US20080318432
Pub Dt:
12/25/2008
Title:
REACTOR WITH HEATED AND TEXTURED ELECTRODES AND SURFACES
37
Patent #:
7955870
Issue Dt:
06/07/2011
Application #:
12552664
Filing Dt:
09/02/2009
Publication #:
US20100022030
Pub Dt:
01/28/2010
Title:
DRY ETCH STOP PROCESS FOR ELIMINATING ELECTRICAL SHORTING IN MRAM DEVICE STRUCTURES
Assignor
1
COMERICA BANK
Exec Dt:
11/20/2014
Assignee
1
OEM GROUP, INC.
2120 W. GUADALUPE
GILBERT, ARIZONA 85233
Correspondence name and address
ANGELA ALVAREZ SUJEK - BODMAN PLC
201 SOUTH DIVISION, SUITE 400
ANN ARBOR, MI 48104

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