Patent Assignment Details
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Reel/Frame: | 021493/0496 | |
| Pages: | 5 |
| | Recorded: | 09/08/2008 | | |
Attorney Dkt #: | 108298810US1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/05/2009
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Application #:
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11872607
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Filing Dt:
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10/15/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Title:
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INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP SITES ON BOND-PADS
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Assignee
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8000 SOUTH FEDERAL WAY, PO BOX 6 |
BOISE, IDAHO 83716-9632 |
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Correspondence name and address
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PERKINS COIE LLP PATENT-SEA
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PO BOX 1247
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PAUL T. PARKER
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SEATTLE, WA 98111-1247
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