Patent Assignment Details
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| Reel/Frame: | 017718/0514 | |
| Pages: | 2 |
| | Recorded: | 04/04/2006 | | |
| Attorney Dkt #: | 742433-45 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/02/2004
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Application #:
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10316088
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Filing Dt:
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12/11/2002
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Publication #:
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Pub Dt:
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09/25/2003
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Title:
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METHOD FOR INTEGRATING COMPOUND SEMICONDUCTOR WITH SUBSTRATE OF HIGH THERMAL CONDUCTIVITY
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Assignee
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| 5 LI-HSIN 5TH RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. 300 |
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Correspondence name and address
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DONALD R. STUDEBAKER
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NIXON PEABODY LLP
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SUITE 900
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401 9TH STREET, N.W.
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WASHINGTON, D.C. 20004-2128
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