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Total properties:
28
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Patent #:
|
|
Issue Dt:
|
07/13/2004
|
Application #:
|
09872678
|
Filing Dt:
|
06/01/2001
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Publication #:
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Pub Dt:
|
11/29/2001
| | | | |
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Title:
|
HIGH-PERFORMANCE HEAT SINK FOR ELECTRONICS COOLING
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Patent #:
|
|
Issue Dt:
|
07/23/2002
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Application #:
|
09908327
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Filing Dt:
|
07/18/2001
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Title:
|
ULTRA HIGH FIN DENSITY HEAT SINK FOR ELECTRONICS COOLING
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|
|
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Patent #:
|
|
Issue Dt:
|
07/15/2003
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Application #:
|
10079214
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Filing Dt:
|
02/20/2002
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Title:
|
HIGH PERFORMANCE PIN FIN HEAT SINK FOR ELECTRONICS COOLING
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/30/2003
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Application #:
|
10119911
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Filing Dt:
|
04/09/2002
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|
Publication #:
|
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Pub Dt:
|
10/09/2003
| | | | |
|
Title:
|
HEAT SINK WITH MULTIPLE SURFACE ENHANCEMENTS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/2003
|
Application #:
|
10198321
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Filing Dt:
|
07/18/2002
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|
Title:
|
THERMOSIPHON FOR ELECTRONICS COOLING WITH HIGH PERFORMANCE BOILING AND CONDENSING SURFACES
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|
|
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Patent #:
|
|
Issue Dt:
|
01/11/2005
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Application #:
|
10374346
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Filing Dt:
|
02/25/2003
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|
Publication #:
|
|
Pub Dt:
|
08/26/2004
| | | | |
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Title:
|
COMPACT THERMOSIPHON FOR DISSIPATING HEAT GENERATED BY ELECTRONIC COMPONENTS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/24/2004
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Application #:
|
10374349
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Filing Dt:
|
02/25/2003
|
|
Title:
|
ORIENTATION INSENSITIVE THERMOSIPHON ASSEMBLY FOR COOLING ELECTRONIC COMPONENTS
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|
|
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|
Patent #:
|
|
Issue Dt:
|
05/26/2009
|
Application #:
|
11033334
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Filing Dt:
|
01/11/2005
|
|
Publication #:
|
|
Pub Dt:
|
07/21/2005
| | | | |
|
Title:
|
METHOD OF MAKING HIGH PERFORMANCE HEAT SINKS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/18/2006
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Application #:
|
11040321
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Filing Dt:
|
01/21/2005
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|
Publication #:
|
|
Pub Dt:
|
07/27/2006
| | | | |
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Title:
|
LIQUID COOLED THERMOSIPHON WITH FLEXIBLE COOLANT TUBES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/20/2009
|
Application #:
|
11153107
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Filing Dt:
|
06/15/2005
|
|
Publication #:
|
|
Pub Dt:
|
12/21/2006
| | | | |
|
Title:
|
INTEGRATED LIQUID COOLED HEAT SINK FOR ELECTRONIC COMPONENTS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/19/2008
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Application #:
|
11205338
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Filing Dt:
|
08/17/2005
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|
Publication #:
|
|
Pub Dt:
|
02/22/2007
| | | | |
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Title:
|
RADIAL FLOW MICRO-CHANNEL HEAT SINK WITH IMPINGEMENT COOLING
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/09/2008
|
Application #:
|
11236019
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Filing Dt:
|
09/27/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/29/2007
| | | | |
|
Title:
|
OPTIMALLY SHAPED SPREADER PLATE FOR ELECTRONICS COOLING ASSEMBLY
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2007
|
Application #:
|
11242738
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Filing Dt:
|
10/04/2005
|
|
Publication #:
|
|
Pub Dt:
|
04/05/2007
| | | | |
|
Title:
|
HEAT SINK WITH MULTIPLE COOLANT INLETS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/19/2008
|
Application #:
|
11333655
|
Filing Dt:
|
01/17/2006
|
|
Publication #:
|
|
Pub Dt:
|
07/19/2007
| | | | |
|
Title:
|
MICROCHANNEL HEAT SINK
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/07/2009
|
Application #:
|
11395697
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Filing Dt:
|
03/31/2006
|
|
Publication #:
|
|
Pub Dt:
|
10/04/2007
| | | | |
|
Title:
|
LIQUID COOLED THERMOSIPHON WITH CONDENSER COIL RUNNING IN AND OUT OF LIQUID REFRIGERANT
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2008
|
Application #:
|
11407452
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Filing Dt:
|
04/20/2006
|
|
Publication #:
|
|
Pub Dt:
|
10/25/2007
| | | | |
|
Title:
|
LOW PROFILE THERMOSIPHON
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2009
|
Application #:
|
11434645
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Filing Dt:
|
05/16/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/22/2007
| | | | |
|
Title:
|
ORIENTATION INSENSITIVE COMPACT THERMOSIPHON WITH A REMOTE AUXILIARY CONDENSER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/06/2009
|
Application #:
|
11439042
|
Filing Dt:
|
05/23/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/29/2007
| | | | |
|
Title:
|
IMPINGEMENT COOLED HEAT SINK WITH LOW PRESSURE DROP
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11439043
|
Filing Dt:
|
05/23/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/29/2007
| | | | |
|
Title:
|
Compact liquid cooling unit for high end servers
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2008
|
Application #:
|
11448591
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Filing Dt:
|
06/07/2006
|
|
Publication #:
|
|
Pub Dt:
|
12/13/2007
| | | | |
|
Title:
|
COMPACT MODULAR CPU COOLING UNIT
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11453717
|
Filing Dt:
|
06/15/2006
|
|
Publication #:
|
|
Pub Dt:
|
12/20/2007
| | | | |
|
Title:
|
Thermosiphon with thermoelectrically enhanced spreader plate
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/13/2009
|
Application #:
|
11505724
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Filing Dt:
|
08/17/2006
|
|
Publication #:
|
|
Pub Dt:
|
02/21/2008
| | | | |
|
Title:
|
AIR COOLED COMPUTER CHIP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/13/2009
|
Application #:
|
11599942
|
Filing Dt:
|
11/15/2006
|
|
Publication #:
|
|
Pub Dt:
|
05/15/2008
| | | | |
|
Title:
|
ORIENTATION INSENSITIVE MULTI CHAMBER THERMOSIPHON
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2011
|
Application #:
|
11701213
|
Filing Dt:
|
02/01/2007
|
|
Publication #:
|
|
Pub Dt:
|
08/07/2008
| | | | |
|
Title:
|
INTEGRATED LIQUID COOLING UNIT FOR COMPUTERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/07/2009
|
Application #:
|
11731202
|
Filing Dt:
|
03/30/2007
|
|
Publication #:
|
|
Pub Dt:
|
10/02/2008
| | | | |
|
Title:
|
THERMOSIPHON FOR LAPTOP COMPUTER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2010
|
Application #:
|
11731204
|
Filing Dt:
|
03/30/2007
|
|
Publication #:
|
|
Pub Dt:
|
10/02/2008
| | | | |
|
Title:
|
HIGH PERFORMANCE COMPACT THERMOSIPHON WITH INTEGRATED BOILER PLATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2009
|
Application #:
|
11731641
|
Filing Dt:
|
03/30/2007
|
|
Publication #:
|
|
Pub Dt:
|
10/02/2008
| | | | |
|
Title:
|
THERMOSIPHON FOR LAPTOP COMPUTER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2010
|
Application #:
|
11904115
|
Filing Dt:
|
09/26/2007
|
|
Publication #:
|
|
Pub Dt:
|
03/26/2009
| | | | |
|
Title:
|
THERMOSIPHON FOR LAPTOP COMPUTERS COMPRISING A BOILING CHAMBER WITH A SQUARE WAVE PARTITION
|
|
