Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 066123/0544 | |
| Pages: | 2 |
| | Recorded: | 12/24/2023 | | |
| Attorney Dkt #: | 1725AS-1 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/28/2014
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Application #:
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13523261
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Filing Dt:
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06/14/2012
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Publication #:
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Pub Dt:
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12/19/2013
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TIEBAR-LESS DESIGN AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE |
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Correspondence name and address
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JCIPRNET
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8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
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TAIPEI, 100404 TAIWAN
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