Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 015953/0545 | |
| Pages: | 2 |
| | Recorded: | 03/24/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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02/10/2004
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Application #:
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09715446
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Filing Dt:
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11/17/2000
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Title:
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MICROMECHANICAL SYSTEM FABRICATION METHOD USING (111) SINGLE CRYSTALLINE SILICON
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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09756981
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Filing Dt:
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01/09/2001
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Publication #:
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Pub Dt:
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08/16/2001
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Title:
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ISOLATION IN MICROMACHINED SINGLE CRYSTAL SILICON USING DEEP TRENCH INSULATION
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Patent #:
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Issue Dt:
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05/27/2003
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Application #:
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09885832
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Filing Dt:
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06/19/2001
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Publication #:
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Pub Dt:
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01/03/2002
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Title:
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TRIPLE LAYER ISOLATION FOR SILICON MICROSTRUCTURE AND STRUCTURES FORMED USING THE SAME
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Assignee
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| TAEWHA VILLA #302, BANGBAE-4-DONG |
| SOCHO-GU |
| SEOUL, JAPAN 137-831 |
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Correspondence name and address
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SCHWEITZER CORNMAN GROSS & BONDELL LLP
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JAY A. BONDELL, ESQ.
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292 MADISON AVENUE 19TH FLOOR
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NEW YORK, NY 10017
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