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Patent Assignment Details
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Reel/Frame:051765/0550   Pages: 3
Recorded: 01/31/2020
Attorney Dkt #:IMB 15 US CON
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/08/2013
Application #:
12773628
Filing Dt:
05/04/2010
Publication #:
Pub Dt:
08/26/2010
Title:
ELECTRONICS MODULE COMPRISING AN EMBEDDED MICROCIRCUIT
Assignor
1
Exec Dt:
10/03/2013
Assignee
1
KUORTANEENKATU 2
HELSINKI, FINLAND 00510
Correspondence name and address
SEPPO LAINE OY
P.O. BOX 339
HELSINKI, 00181 FINLAND

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