Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 007144/0556 | |
| Pages: | 4 |
| | Recorded: | 09/08/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/07/1995
|
Application #:
|
08303254
|
Filing Dt:
|
09/08/1994
|
|
Title:
|
HIGH PERFORMANCE THERMAL INTERFACE FOR LOW TEMPERATURE ELECTRONIC MODULES
|
|
|
Assignee
|
|
|
|
|
| OLD ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
|
|
Correspondence name and address
|
| |
LILY NEFF
|
| |
IBM CORPORATION
|
| |
INTELLECTUAL PROPERTY LAW
|
| |
522 SOUTH ROAD, MS P903
|
| |
POUGHKEEPSIE, NY 12601-5400
|
Search Results as of:
05/23/2024 02:53 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
