Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 009614/0556 | |
| Pages: | 13 |
| | Recorded: | 12/03/1998 | | |
| Conveyance: | CORRECTIVE SECURITY AGREEMENT TO CORRECT THE CONVEYING PARTY(IES) NAME. A SECURITY AGREEMENT PREVIOUSLY RECORDED ON REEL 7795, FRAME 0282. |
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Total properties:
3
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Patent #:
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Issue Dt:
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09/29/1981
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Application #:
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06122527
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Filing Dt:
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02/19/1980
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Title:
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CERAMIC LID ASSEMBLY FOR HERMETIC SEALING OF A SEMICONDUCTOR CHIP
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Patent #:
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Issue Dt:
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10/26/1982
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Application #:
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06235094
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Filing Dt:
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02/17/1981
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Title:
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METHOD OF MAKING CERAMIC LID ASSEMBLY FOR HERMETIC SEALING OF A SEMICONDUCTOR CHIP
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Patent #:
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Issue Dt:
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05/09/1995
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Application #:
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08064255
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Filing Dt:
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05/20/1993
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Title:
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METHOD FOR MAKING HEAT-DISSIPATING ELEMENTS FOR MICRO-ELECTRONIC DEVICES
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Assignee
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| 300 MAIN STREET |
| STAMFORD, CONNECTICUT 06904 |
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Correspondence name and address
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ROBINSON & COLE LLP
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AMY SPAN WERGELES, ESQ.
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280 TRUMBULL STREET
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HARTFORD, CT 06103-3597
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