Patent Assignment Details
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| Reel/Frame: | 017587/0556 | |
| Pages: | 3 |
| | Recorded: | 05/08/2006 | | |
| Attorney Dkt #: | CPAC 1117-2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11388755
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Filing Dt:
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03/24/2006
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Publication #:
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Pub Dt:
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09/28/2006
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Title:
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Flip chip interconnection having narrow interconnection sites on the substrate
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Assignee
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| 10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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BILL KENNEDY
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HAYNES BEFFEL & WOLFELD LLP
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P.O. BOX 366
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HALF MOON BAY, CA 94019
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