Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 049222/0557 | |
| Pages: | 22 |
| | Recorded: | 05/17/2019 | | |
| Attorney Dkt #: | AB4135-US |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE THE WRONG APPLICATION NUMBER WAS ENTERED VIA EPAS (15227364 INSTEAD OF 16227364) PREVIOUSLY RECORDED ON REEL 048381 FRAME 0052. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT TO INTEL CORPORATION. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16227364
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Filing Dt:
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12/20/2018
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Publication #:
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Pub Dt:
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08/01/2019
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Title:
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BUFFERED INTERCONNECT FOR HIGHLY SCALABLE ON-DIE FABRIC
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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R. ALAN BURNETT
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4108 131 AVE SE
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BELLEVUE, WA 98006
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