Patent Assignment Details
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Reel/Frame: | 038592/0560 | |
| Pages: | 5 |
| | Recorded: | 05/02/2016 | | |
Attorney Dkt #: | WAFER-32756/US-10/CON |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD INVENTOR NAME PREVIOUSLY RECORDED AT REEL: 038423 FRAME: 0798. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15138869
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Filing Dt:
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04/26/2016
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Publication #:
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Pub Dt:
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08/18/2016
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Title:
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Thermo-controllable high-density chips for multiplex analyses
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Assignee
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7400 PASEO PARKWAY |
FREMONT, CALIFORNIA 94555 |
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Correspondence name and address
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JASON R. BOND
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2275 DEMING WAY, SUITE 310
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MIDDLETON, WI 53562
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05/27/2024 08:19 AM
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