Patent Assignment Details
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| Reel/Frame: | 011384/0565 | |
| Pages: | 2 |
| | Recorded: | 12/15/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/21/2003
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Application #:
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09737673
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Filing Dt:
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12/15/2000
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Publication #:
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Pub Dt:
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06/20/2002
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Title:
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METHOD OF ENCAPSULATING A SUBSTRATE-BASED PACKAGE ASSEMBLY WITHOUT CAUSING MOLD FLASH
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Assignee
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| TANTZU |
| NO. 123, SEC. 3, DA FONG ROAD |
| TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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EDWARDS & ANGELL, LLP
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DIKE, BRONSTEIN, ROBERTS & CUSHMAN
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PETER F. CORLESS-IP GROUP
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130 WATER STREET
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BOSTON, MA 02109
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