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Reel/Frame:017945/0581   Pages: 5
Recorded: 07/17/2006
Attorney Dkt #:FIS920030342US1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/23/2009
Application #:
10597066
Filing Dt:
07/10/2006
Publication #:
Pub Dt:
06/07/2007
Title:
METHOD OF FORMING THIN SGOI WAFERS WITH HIGH RELAXATION AND LOW STACKING FAULT DEFECT DENSITY
Assignors
1
Exec Dt:
06/21/2006
2
Exec Dt:
06/28/2006
3
Exec Dt:
06/28/2006
4
Exec Dt:
07/06/2006
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
INTERNATIONAL BUSINESS MACHINES CORP.
2070 ROUTE 52
YUANMIN CAI, BLDG. 321-482
HOPEWELL JUNCTION, NY 12533

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