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Patent Assignment Details

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Reel/Frame:	023107/0581			Pages:	15
		Recorded:	08/18/2009
Attorney Dkt #:	CASA-GEN
Conveyance:	CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 023015 FRAME 0720. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME FROM CASANTRA ACQUISTION III LLC TO CASANTRA ACQUISITION III LLC.

Total properties: 27

Patent #:	5169679	Issue Dt:	12/08/1992	Application #:	07256017	Filing Dt:	10/11/1988
Title:	POST-TERMINATION APPARATUS AND PROCESS FOR THICK FILM RESISTORS OF PRINTED CIRCUIT BOARDS

Patent #:	5151777	Issue Dt:	09/29/1992	Application #:	07422395	Filing Dt:	10/16/1989
Title:	AN INTERFACE DEVICE FOR THERMALLY COUPLING AN INTEGRATED CIRCUIT TO A HEAT SINK

Patent #:	5164698	Issue Dt:	11/17/1992	Application #:	07724011	Filing Dt:	07/01/1991
Title:	POST-TERMINATION APPARATUS AND PROCESS FOR THICK FILM RESISTORS OF PRINTED CIRCUIT BOARDS

Patent #:	5395679	Issue Dt:	03/07/1995	Application #:	08038379	Filing Dt:	03/29/1993
Title:	ULTRA-THICK THICK FILMS FOR THERMAL MANAGEMENT AND CURRENT CARRYING CAPABILITIES IN HYBRID CIRCUITS

Patent #:	5456109	Issue Dt:	10/10/1995	Application #:	08038422	Filing Dt:	03/29/1993
Title:	THICK FILM ROTATIONAL ACCELEROMETER HAVING TWO STRUCTURALLY INTEGRATED ACCELERATION SENSORS

Patent #:	5527627	Issue Dt:	06/18/1996	Application #:	08342966	Filing Dt:	11/21/1994
Title:	INK COMPOSITION FOR AN ULTRA-THICK THICK FILM FOR THERMAL MANAGEMENT OF A HYBRID CIRCUIT

Patent #:	5527999	Issue Dt:	06/18/1996	Application #:	08391740	Filing Dt:	02/21/1995
Title:	MULTILAYER CONDUCTOR FOR PRINTED CIRCUITS

Patent #:	5621240	Issue Dt:	04/15/1997	Application #:	08523580	Filing Dt:	09/05/1995
Title:	SEGMENTED THICK FILM RESISTORS

Patent #:	5716552	Issue Dt:	02/10/1998	Application #:	08668900	Filing Dt:	06/24/1996
Title:	THICK-FILM CONDUCTOR COMPOSITIONS COMPRISING SILVER OR PALLADIUM PARTICLES COATED WITH ALUMINA OR ZIRCONIA

Patent #:	5926731	Issue Dt:	07/20/1999	Application #:	08887064	Filing Dt:	07/02/1997
Title:	METHOD FOR CONTROLLING SOLDER BUMP SHAPE AND STAND-OFF HEIGHT

Patent #:	5867886	Issue Dt:	02/09/1999	Application #:	08954266	Filing Dt:	10/20/1997
Title:	METHOD OF MAKING A THICK FILM PRESSURE SENSOR

Patent #:	5928568	Issue Dt:	07/27/1999	Application #:	08954385	Filing Dt:	10/20/1997
Title:	THICK FILM CIRCUIT HAVING IMPROVED CONDUCTOR COMPOSITON WITH COATED METALLIC PARTICLES

Patent #:	5962151	Issue Dt:	10/05/1999	Application #:	08985436	Filing Dt:	12/05/1997
Title:	METHOD FOR CONTROLLING SOLDERABILITY OF A CONDUCTOR AND CONDUCTOR FORMED THEREBY

Patent #:	5910334	Issue Dt:	06/08/1999	Application #:	08991685	Filing Dt:	12/16/1997
Title:	METHOD OF MANUFACTURE FOR A THICK FILM MULTI-LAYER CIRCUIT

Patent #:	5898359	Issue Dt:	04/27/1999	Application #:	08994113	Filing Dt:	12/19/1997
Title:	DIFFUSION-BARRIER MATERIALS FOR THICK-FILM PIEZORESISTORS AND SENSORS FORMED THEREWITH

Patent #:	5959214	Issue Dt:	09/28/1999	Application #:	08995801	Filing Dt:	12/22/1997
Title:	STRAIN GAUGE WITH STEEL SUBSTRATE

Patent #:	6531663	Issue Dt:	03/11/2003	Application #:	09016504	Filing Dt:	01/30/1998
Title:	SOLDER STOP FOR AN ELECTRICAL CONNECTION AND METHOD THEREFOR

Patent #:	6007867	Issue Dt:	12/28/1999	Application #:	09106788	Filing Dt:	06/29/1998
Title:	METHOD OF MANUFACTURING A THICK FILM CIRCUIT WITH IMPROVED DIELECTRIC FEATURE DEFINITION

Patent #:	6022756	Issue Dt:	02/08/2000	Application #:	09127291	Filing Dt:	07/31/1998
Title:	METAL DIAPHRAGM SENSOR WITH POLYSILICON SENSING ELEMENTS AND METHODS THEREFOR

Patent #:	6180164	Issue Dt:	01/30/2001	Application #:	09178758	Filing Dt:	10/26/1998
Title:	METHOD OF FORMING RUTHENIUM-BASED THICK-FILM RESISTORS

Patent #:	6233817	Issue Dt:	05/22/2001	Application #:	09232951	Filing Dt:	01/17/1999
Title:	METHOD OF FORMING THICK-FILM HYBRID CIRCUIT ON A METAL CIRCUIT BOARD

Patent #:	6328914	Issue Dt:	12/11/2001	Application #:	09240084	Filing Dt:	01/29/1999
Title:	THICK-FILM PASTE WITH INSOLUBLE ADDITIVE

Patent #:	6150041	Issue Dt:	11/21/2000	Application #:	09344046	Filing Dt:	06/25/1999
Title:	THICK-FILM CIRCUITS AND METALLIZATION PROCESS

Patent #:	6391678	Issue Dt:	05/21/2002	Application #:	09344971	Filing Dt:	06/28/1999
Title:	METHOD FOR CONTROLLING SOLDERABILITY OF A CONDUCTOR AND CONDUCTOR FORMED THEREBY

Patent #:	6164522	Issue Dt:	12/26/2000	Application #:	09384892	Filing Dt:	08/27/1999
Title:	METHOD OF MANUFACTURING A THICK FILM CIRCUIT WITH CONSTRAINED ADHESIVE SPREADING

Patent #:	6221514	Issue Dt:	04/24/2001	Application #:	09385051	Filing Dt:	08/30/1999
Title:	HIGH CURRENT CIRCUIT TRACE AND COMPOSITION AND METHOD THEREFOR

Patent #:	6362435	Issue Dt:	03/26/2002	Application #:	09467500	Filing Dt:	12/20/1999
Title:	MULTI-LAYER CONDUCTOR PAD FOR REDUCING SOLDER Voiding

Assignor

Exec Dt:

05/15/2009

Assignee

160 GREENTREE DRIVE

SUITE 101

DOVER, DELAWARE 19904

Correspondence name and address
	SADLER, BREEN, MORASCH & COLBY, PS
	422 WEST RIVERSIDE AVENUE
	SUITE 424
	SPOKANE, WA 99201

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