Patent Assignment Details
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| Reel/Frame: | 011150/0583 | |
| Pages: | 3 |
| | Recorded: | 09/12/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/28/2003
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Application #:
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09660270
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Filing Dt:
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09/12/2000
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Title:
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SEMICONDUCTOR CHIP STRUCTURES WITH EMBEDDED THERMAL CONDUCTORS AND A THERMAL SINK DISPOSED OVER OPPOSING SUBSTRATE SURFACES
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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HESLIN & ROTHENBERG, P.C.
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KEVIN P. RADIGAN
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5 COLUMBIA CIRCLE
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ALBANY, NY 12203
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