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260
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Patent #:
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Issue Dt:
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09/11/2012
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Application #:
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13135070
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Filing Dt:
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06/23/2011
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Title:
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BUMPED CHIP PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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05/14/2013
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Application #:
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13135091
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Filing Dt:
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06/23/2011
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Title:
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HEAT SPREADER PACKAGE
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Patent #:
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Issue Dt:
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07/24/2012
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Application #:
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13136457
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Filing Dt:
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08/01/2011
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING A TOP-SURFACE METAL LAYER FOR IMPLEMENTING CIRCUIT FEATURES
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Patent #:
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Issue Dt:
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11/06/2012
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Application #:
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13151571
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Filing Dt:
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06/02/2011
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Title:
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FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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13161380
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Filing Dt:
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06/15/2011
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Title:
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INCREASED I/O LEADFRAME AND SEMICONDUCTOR DEVICE INCLUDING SAME
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Patent #:
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Issue Dt:
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10/23/2018
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Application #:
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13169385
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Filing Dt:
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06/27/2011
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Title:
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INTEGRATED SHIELD PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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09/02/2014
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Application #:
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13181248
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Filing Dt:
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07/12/2011
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Title:
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SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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13233606
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Filing Dt:
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09/15/2011
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Title:
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ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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01/21/2014
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Application #:
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13236916
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Filing Dt:
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09/20/2011
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Title:
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UNDERFILL CONTACTING STACKING BALLS PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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10/15/2013
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Application #:
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13246564
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Filing Dt:
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09/27/2011
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Title:
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PACKAGE IN PACKAGE DEVICE FOR RF TRANSCEIVER MODULE
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Patent #:
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Issue Dt:
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10/21/2014
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Application #:
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13270000
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Filing Dt:
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10/10/2011
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Title:
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SEMICONDUCTOR DEVICE WITH INCREASED I/O CONFIGURATION
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Patent #:
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Issue Dt:
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05/12/2015
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Application #:
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13272096
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Filing Dt:
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10/12/2011
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Title:
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MOLDED CAVITY SUBSTRATE MEMS PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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09/01/2015
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Application #:
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13274877
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Filing Dt:
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10/17/2011
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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09/03/2013
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Application #:
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13286005
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Filing Dt:
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10/31/2011
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Title:
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SEMICONDUCTOR PACKAGE HAVING A PLURALITY OF INPUT/OUTPUT MEMBERS
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Patent #:
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Issue Dt:
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09/09/2014
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Application #:
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13286903
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Filing Dt:
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11/01/2011
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE AND METHOD OF FABRICATING WAFER LEVEL CHIP SCALE PACKAGE
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Patent #:
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Issue Dt:
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07/24/2012
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Application #:
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13290451
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Filing Dt:
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11/07/2011
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Title:
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SEMICONDUCTOR PACKAGE WITH INCREASED I/O DENSITY AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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13302501
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Filing Dt:
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11/22/2011
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Title:
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WAFER LEVEL FAN OUT PACKAGE
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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13306685
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Filing Dt:
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11/29/2011
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Title:
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CONDUCTIVE PAD ON PROTRUDING THROUGH ELECTRODE SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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13327440
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Filing Dt:
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12/15/2011
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Title:
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ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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13348304
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Filing Dt:
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01/11/2012
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Publication #:
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Pub Dt:
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05/03/2012
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Title:
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REVERSIBLE TOP/BOTTOM MEMS PACKAGE
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Patent #:
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Issue Dt:
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03/31/2015
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Application #:
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13350619
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Filing Dt:
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01/13/2012
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Publication #:
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Pub Dt:
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05/10/2012
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Title:
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MOLDED IMAGE SENSOR PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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10/06/2015
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Application #:
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13356330
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Filing Dt:
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01/23/2012
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Title:
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SHIELDING TECHNIQUE FOR SEMICONDUCTOR PACKAGE INCLUDING METAL LID AND METALIZED CONTACT AREA
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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13356349
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Filing Dt:
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01/23/2012
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Title:
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SHIELDING TECHNIQUE FOR SEMICONDUCTOR PACKAGE INCLUDING METAL LID
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Patent #:
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Issue Dt:
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10/30/2012
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Application #:
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13358947
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Filing Dt:
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01/26/2012
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Title:
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WAFER LEVEL PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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08/01/2017
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Application #:
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13398646
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Filing Dt:
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02/16/2012
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Title:
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METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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13399321
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Filing Dt:
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02/17/2012
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Title:
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ELECTRONIC COMPONENT PACKAGE HAVING BLEED CHANNEL STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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07/11/2017
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Application #:
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13412848
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Filing Dt:
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03/06/2012
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Title:
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SEMICONDUCTOR DEVICE WITH LEADFRAME CONFIGURED TO FACILITATE REDUCED BURR FORMATION
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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13434181
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Filing Dt:
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03/29/2012
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Title:
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EMBEDDED COMPONENT PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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06/02/2015
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Application #:
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13434217
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Filing Dt:
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03/29/2012
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Title:
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BACKSIDE WARPAGE CONTROL STRUCTURE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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03/04/2014
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Application #:
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13447650
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Filing Dt:
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04/16/2012
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Title:
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ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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03/24/2015
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Application #:
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13452006
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Filing Dt:
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04/20/2012
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Title:
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WARPAGE CONTROL STIFFENER RING PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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06/23/2015
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Application #:
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13454881
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Filing Dt:
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04/24/2012
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Title:
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INTEGRATED CIRCUIT WITH EFFICIENT MEMS ARCHITECTURE
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13454972
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Filing Dt:
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04/24/2012
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Publication #:
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Pub Dt:
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05/02/2013
| | | | |
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Title:
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METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING AN INTERPOSER
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Patent #:
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Issue Dt:
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11/18/2014
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Application #:
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13455539
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Filing Dt:
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04/25/2012
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Publication #:
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Pub Dt:
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11/01/2012
| | | | |
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Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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07/22/2014
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Application #:
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13458353
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Filing Dt:
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04/27/2012
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Title:
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ELECTRICAL CIRCUIT WITH COMPONENT-ACCOMMODATING LID
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Patent #:
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Issue Dt:
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05/05/2015
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Application #:
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13459661
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Filing Dt:
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04/30/2012
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Title:
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WIRE FENCE FINGERPRINT SENSOR PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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10/18/2016
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Application #:
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13466717
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Filing Dt:
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05/08/2012
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Publication #:
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Pub Dt:
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11/29/2012
| | | | |
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Title:
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LEAD FRAME FOR SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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13472961
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Filing Dt:
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05/16/2012
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Title:
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DIRECT-WRITE WAFER LEVEL CHIP SCALE PACKAGE
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Patent #:
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Issue Dt:
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08/30/2016
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Application #:
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13475469
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Filing Dt:
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05/18/2012
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Title:
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SHIELD LID INTERCONNECT PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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01/21/2014
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Application #:
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13479829
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Filing Dt:
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05/24/2012
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Title:
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IC PACKAGE WITH INTEGRATED ELECTROSTATIC DISCHARGE PROTECTION
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Patent #:
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Issue Dt:
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01/14/2014
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Application #:
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13487705
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Filing Dt:
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06/04/2012
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Title:
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STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
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Patent #:
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Issue Dt:
|
02/05/2013
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Application #:
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13487713
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Filing Dt:
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06/04/2012
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE
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Patent #:
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|
Issue Dt:
|
06/18/2013
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Application #:
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13528199
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Filing Dt:
|
06/20/2012
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|
Title:
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STACKABLE SEMICONDUCTOR PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
04/22/2014
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Application #:
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13528206
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Filing Dt:
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06/20/2012
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Title:
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STACKABLE VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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01/27/2015
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Application #:
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13546870
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Filing Dt:
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07/11/2012
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Title:
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DIE SEAL DESIGN AND METHOD AND APPARATUS FOR INTEGRATED CIRCUIT PRODUCTION
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Patent #:
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Issue Dt:
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12/16/2014
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Application #:
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13564567
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Filing Dt:
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08/01/2012
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Title:
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DESIGN AND METHOD FOR CONTROLLING MOLDING COMPOUND GEOMETRY AROUND A SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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04/28/2015
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Application #:
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13566082
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Filing Dt:
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08/03/2012
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Publication #:
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Pub Dt:
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02/14/2013
| | | | |
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Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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04/23/2013
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Application #:
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13569865
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Filing Dt:
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08/08/2012
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Title:
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BUMPED CHIP PACKAGE
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Patent #:
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Issue Dt:
|
05/31/2016
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Application #:
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13596322
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Filing Dt:
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08/28/2012
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Publication #:
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Pub Dt:
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02/14/2013
| | | | |
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Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
|
02/03/2015
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Application #:
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13603039
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Filing Dt:
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09/04/2012
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Title:
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MUSHROOM SHAPED BUMP ON REPASSIVATION
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Patent #:
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Issue Dt:
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01/27/2015
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Application #:
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13608521
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Filing Dt:
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09/10/2012
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Title:
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PROCESSING SOLDERBRACE USING LIGHT WAVELENGTH FILTER AND A BROADBAND LIGHT SOURCE (As amended)
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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13608544
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Filing Dt:
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09/10/2012
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Title:
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MERGED FIDUCIAL FOR SEMICONDUCTOR CHIP PACKAGES
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Patent #:
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Issue Dt:
|
02/23/2016
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Application #:
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13614631
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Filing Dt:
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09/13/2012
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Title:
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MOLDED ELECTRONIC PACKAGE GEOMETRY TO CONTROL WARPAGE AND DIE STRESS
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Patent #:
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Issue Dt:
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09/24/2013
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Application #:
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13614649
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Filing Dt:
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09/13/2012
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Publication #:
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Pub Dt:
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02/28/2013
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Title:
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PRINT CONTROL METHOD AND APPARATUS
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Patent #:
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Issue Dt:
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03/19/2013
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Application #:
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13621076
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Filing Dt:
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09/15/2012
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Publication #:
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Pub Dt:
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01/10/2013
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Title:
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SEMICONDUCTOR DEVICE FOR IMPROVING ELECTRICAL AND MECHANICAL CONNECTIVITY OF CONDUCTIVE PILLERS AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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13627815
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Filing Dt:
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09/26/2012
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Title:
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WAFER LEVEL PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
|
10/07/2014
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Application #:
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13662702
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Filing Dt:
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10/29/2012
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
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Patent #:
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|
Issue Dt:
|
05/10/2016
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Application #:
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13663001
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Filing Dt:
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10/29/2012
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Title:
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METHOD AND SYSTEM FOR SOLDER SHIELDING OF BALL GRID ARRAYS
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Patent #:
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Issue Dt:
|
04/26/2016
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Application #:
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13663208
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Filing Dt:
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10/29/2012
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Title:
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THROUGH VIA NUB REVEAL METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
|
07/02/2013
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Application #:
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13665295
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Filing Dt:
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10/31/2012
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13671194
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Filing Dt:
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11/07/2012
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Publication #:
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Pub Dt:
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05/08/2014
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Title:
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Method And System For A Chaser Pellet In A Semiconductor Package Mold Process
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Patent #:
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Issue Dt:
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08/05/2014
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Application #:
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13678012
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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05/15/2014
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Title:
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Method And System For A Semiconductor Device Package With A Die-To-Die First Bond
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13678026
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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05/15/2014
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Title:
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METHODS FOR TEMPORARY WAFER MOLDING FOR CHIP-ON-WAFER ASSEMBLY
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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13678046
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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05/15/2014
| | | | |
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Title:
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Method And System For A Semiconductor Device Package With A Die To Interposer Wafer First Bond
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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13678058
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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05/15/2014
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Title:
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METHOD AND SYSTEM FOR A SEMICONDUCTOR FOR DEVICE PACKAGE WITH A DIE-TO-PACKAGING SUBSTRATE FIRST BOND
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Patent #:
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Issue Dt:
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06/27/2017
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Application #:
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13679627
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Filing Dt:
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11/16/2012
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Title:
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BUILDUP DIELECTRIC LAYER HAVING METALLIZATION PATTERN SEMICONDUCTOR PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
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06/17/2014
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Application #:
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13680687
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Filing Dt:
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11/19/2012
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Title:
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MECHANICAL TAPE SEPARATION PACKAGE
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Patent #:
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Issue Dt:
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03/24/2015
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Application #:
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13690817
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Filing Dt:
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11/30/2012
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Title:
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Method And System For Backside Dielectric Patterning For Wafer Warpage And Stress Control
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13709414
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Filing Dt:
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12/10/2012
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Publication #:
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Pub Dt:
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06/12/2014
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Title:
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Method And System For Semiconductor Packaging
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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13725645
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Filing Dt:
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12/21/2012
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Publication #:
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Pub Dt:
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08/22/2013
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Title:
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SEMICONDUCTOR PACKAGE WITH ALTERNATING THERMAL INTERFACE AND ADHESIVE MATERIALS AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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04/07/2015
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Application #:
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13726917
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Filing Dt:
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12/26/2012
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Publication #:
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Pub Dt:
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05/15/2014
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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13737325
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Filing Dt:
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01/09/2013
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Title:
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SHIELDED PACKAGE HAVING SHIELD LID
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Patent #:
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Issue Dt:
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12/20/2016
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Application #:
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13738669
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Filing Dt:
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01/10/2013
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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09/09/2014
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Application #:
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13739547
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Filing Dt:
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01/11/2013
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Publication #:
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Pub Dt:
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12/12/2013
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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04/28/2015
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Application #:
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13739565
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Filing Dt:
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01/11/2013
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Publication #:
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Pub Dt:
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06/20/2013
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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13750022
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Filing Dt:
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01/25/2013
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Publication #:
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Pub Dt:
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10/24/2013
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Title:
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METHOD OF FORMING A THIN SUBSTRATE CHIP SCALE PACKAGE DEVICE AND STRUCTURE
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Patent #:
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Issue Dt:
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05/12/2015
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Application #:
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13750532
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Filing Dt:
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01/25/2013
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Publication #:
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Pub Dt:
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10/10/2013
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Title:
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ELECTRONIC PACKAGE STRUCTURE WITH INSULATED ADHESION PORTION FOR AFFIXING AND ISOLATING LANDS SPACED APART FROM LAND CONNECT BAR WITHIN A LEADFRAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13753120
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Filing Dt:
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01/29/2013
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Publication #:
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Pub Dt:
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05/08/2014
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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07/14/2015
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Application #:
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13756167
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Filing Dt:
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01/31/2013
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Title:
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THROUGH VIA RECESSED REVEAL STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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12/22/2015
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Application #:
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13758359
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Filing Dt:
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02/04/2013
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Publication #:
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Pub Dt:
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05/15/2014
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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13763690
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Filing Dt:
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02/10/2013
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Publication #:
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Pub Dt:
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07/18/2013
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Title:
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LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
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Patent #:
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Issue Dt:
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04/22/2014
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Application #:
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13765152
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Filing Dt:
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02/12/2013
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Title:
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FLIP CHIP BUMP STRUCTURE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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01/26/2016
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Application #:
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13765388
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Filing Dt:
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02/12/2013
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Title:
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ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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09/12/2017
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Application #:
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13766171
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Filing Dt:
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02/13/2013
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Title:
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MEMS PACKAGE WITH MEMS DIE, MAGNET, AND WINDOW SUBSTRATE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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06/06/2017
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Application #:
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13793541
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Filing Dt:
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03/11/2013
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Title:
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MICROFLUIDICS SENSOR PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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05/03/2016
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Application #:
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13837283
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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10/10/2013
| | | | |
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Title:
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MOLDED SEMICONDUCTOR PACKAGE WITH SNAP LID
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Patent #:
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Issue Dt:
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10/13/2015
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Application #:
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13861711
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Filing Dt:
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04/12/2013
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Title:
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THROUGH VIA CONNECTED BACKSIDE EMBEDDED CIRCUIT FEATURES STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
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06/02/2015
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Application #:
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13863457
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Filing Dt:
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04/16/2013
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Publication #:
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Pub Dt:
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05/22/2014
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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09/24/2013
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Application #:
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13864750
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Filing Dt:
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04/17/2013
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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09/20/2016
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Application #:
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13892118
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Filing Dt:
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05/10/2013
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Title:
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METHODS FOR TEMPORARY BUSSING OF SEMICONDUCTOR PACKAGE SUBSTRATES
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Patent #:
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Issue Dt:
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03/26/2019
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Application #:
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13894403
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Filing Dt:
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05/14/2013
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Title:
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SEMICONDUCTOR DEVICE WITH METAL DAM AND FABRICATING METHOD
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Patent #:
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Issue Dt:
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04/09/2019
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Application #:
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13896710
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Filing Dt:
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05/17/2013
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Title:
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STACKABLE VARIABLE HEIGHT VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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06/14/2016
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Application #:
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13901837
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Filing Dt:
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05/24/2013
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Publication #:
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Pub Dt:
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12/12/2013
| | | | |
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Title:
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METHOD OF MAKING A SEMICONDUCTOR DEVICE
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|
|
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Patent #:
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Issue Dt:
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11/01/2016
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Application #:
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13903468
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Filing Dt:
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05/28/2013
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Title:
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ROBUST PILLAR STRUCTURE FOR SEMICONDCUTOR DEVICE CONTACTS
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|
|
|
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Patent #:
|
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Issue Dt:
|
11/15/2016
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Application #:
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13912540
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Filing Dt:
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06/07/2013
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Title:
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STACKABLE PACKAGE AND METHOD
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Patent #:
|
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Issue Dt:
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04/08/2014
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Application #:
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13918307
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Filing Dt:
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06/14/2013
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Title:
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WAFER LEVEL PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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12/02/2014
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Application #:
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13927964
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Filing Dt:
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06/26/2013
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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|
|
|
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Patent #:
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Issue Dt:
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06/16/2015
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Application #:
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13937764
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Filing Dt:
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07/09/2013
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Publication #:
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Pub Dt:
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01/16/2014
| | | | |
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Title:
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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|
|
|
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Patent #:
|
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Issue Dt:
|
06/09/2015
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Application #:
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13949186
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Filing Dt:
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07/23/2013
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Publication #:
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Pub Dt:
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02/13/2014
| | | | |
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Title:
|
LEAD FRAME PACKAGE HAVING DISCHARGE HOLES AND METHOD OF MANUFACTURING THE SAME
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|
|
|
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Patent #:
|
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Issue Dt:
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03/22/2016
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Application #:
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13955422
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Filing Dt:
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07/31/2013
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Publication #:
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Pub Dt:
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03/06/2014
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE WITH IMPROVED REDISTRIBUTION LAYER DESIGN AND FABRICATING METHOD THEREOF
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|
