skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:035613/0592   Pages: 24
Recorded: 05/07/2015
Conveyance: PATENT SECURITY AGREEMENT
Total properties: 260
Page 3 of 3
Pages: 1 2 3
1
Patent #:
9406639
Issue Dt:
08/02/2016
Application #:
13962735
Filing Dt:
08/08/2013
Publication #:
US20140042600
Pub Dt:
02/13/2014
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
2
Patent #:
8946883
Issue Dt:
02/03/2015
Application #:
13963384
Filing Dt:
08/09/2013
Publication #:
US20140077366
Pub Dt:
03/20/2014
Title:
WAFER LEVEL FAN-OUT PACKAGE WITH A FIDUCIAL DIE
3
Patent #:
9462690
Issue Dt:
10/04/2016
Application #:
13963635
Filing Dt:
08/09/2013
Title:
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
4
Patent #:
9162871
Issue Dt:
10/20/2015
Application #:
13969052
Filing Dt:
08/16/2013
Title:
METAL MESH LID MEMS PACKAGE AND METHOD
5
Patent #:
8847372
Issue Dt:
09/30/2014
Application #:
13972292
Filing Dt:
08/21/2013
Title:
EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
6
Patent #:
9070675
Issue Dt:
06/30/2015
Application #:
13973492
Filing Dt:
08/22/2013
Publication #:
US20140070408
Pub Dt:
03/13/2014
Title:
Plating Structure For Wafer Level Packages
7
Patent #:
9117684
Issue Dt:
08/25/2015
Application #:
13974443
Filing Dt:
08/23/2013
Title:
SEMICONDUCTOR PACKAGE HAVING A PLURALITY OF INPUT/OUTPUT MEMBERS
8
Patent #:
8981572
Issue Dt:
03/17/2015
Application #:
14017797
Filing Dt:
09/04/2013
Title:
CONDUCTIVE PAD ON PROTRUDING THROUGH ELECTRODE SEMICONDUCTOR DEVICE
9
Patent #:
9214434
Issue Dt:
12/15/2015
Application #:
14017802
Filing Dt:
09/04/2013
Title:
FAN-OUT SEMICONDUCTOR PACKAGE
10
Patent #:
8710649
Issue Dt:
04/29/2014
Application #:
14019136
Filing Dt:
09/05/2013
Title:
WAFER LEVEL PACKAGE AND FABRICATION METHOD
11
Patent #:
9123718
Issue Dt:
09/01/2015
Application #:
14021604
Filing Dt:
09/09/2013
Title:
SHIELDED PACKAGE HAVING SHIELD LID
12
Patent #:
9177932
Issue Dt:
11/03/2015
Application #:
14028290
Filing Dt:
09/16/2013
Title:
SEMICONDUCTOR DEVICE HAVING OVERLAPPED VIA APERTURES
13
Patent #:
9048241
Issue Dt:
06/02/2015
Application #:
14063394
Filing Dt:
10/25/2013
Publication #:
US20150014830
Pub Dt:
01/15/2015
Title:
SEMICONDUCTOR DEVICE UTILZING REDISTRIBUTION LAYERS TO COUPLE STACKED DIE
14
Patent #:
NONE
Issue Dt:
Application #:
14063829
Filing Dt:
10/25/2013
Publication #:
US20150021767
Pub Dt:
01/22/2015
Title:
SEMICONDUCTOR DEVICE WITH PLATED CONDUCTIVE PILLAR COUPLING
15
Patent #:
9502375
Issue Dt:
11/22/2016
Application #:
14063853
Filing Dt:
10/25/2013
Publication #:
US20150021751
Pub Dt:
01/22/2015
Title:
SEMICONDUCTOR DEVICE WITH PLATED PILLARS AND LEADS
16
Patent #:
9510120
Issue Dt:
11/29/2016
Application #:
14066767
Filing Dt:
10/30/2013
Publication #:
US20150117654
Pub Dt:
04/30/2015
Title:
APPARATUS AND METHOD FOR TESTING SOUND TRANSDUCERS
17
Patent #:
10032726
Issue Dt:
07/24/2018
Application #:
14069814
Filing Dt:
11/01/2013
Title:
EMBEDDED VIBRATION MANAGEMENT SYSTEM
18
Patent #:
9293398
Issue Dt:
03/22/2016
Application #:
14072845
Filing Dt:
11/06/2013
Publication #:
US20140131848
Pub Dt:
05/15/2014
Title:
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
19
Patent #:
9576917
Issue Dt:
02/21/2017
Application #:
14082333
Filing Dt:
11/18/2013
Title:
EMBEDDED DIE IN PANEL METHOD AND STRUCTURE
20
Patent #:
9607890
Issue Dt:
03/28/2017
Application #:
14082422
Filing Dt:
11/18/2013
Title:
STRESS RELIEVING THROUGH-SILICON VIAS
21
Patent #:
9129873
Issue Dt:
09/08/2015
Application #:
14082482
Filing Dt:
11/18/2013
Publication #:
US20140138788
Pub Dt:
05/22/2014
Title:
PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF
22
Patent #:
9799592
Issue Dt:
10/24/2017
Application #:
14083779
Filing Dt:
11/19/2013
Publication #:
US20150137384
Pub Dt:
05/21/2015
Title:
SEMICONDUTOR DEVICE WITH THROUGH-SILICON VIA-LESS DEEP WELLS
23
Patent #:
9627368
Issue Dt:
04/18/2017
Application #:
14083917
Filing Dt:
11/19/2013
Publication #:
US20140147970
Pub Dt:
05/29/2014
Title:
SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF
24
Patent #:
9196601
Issue Dt:
11/24/2015
Application #:
14087147
Filing Dt:
11/22/2013
Publication #:
US20150021791
Pub Dt:
01/22/2015
Title:
SEMICONDUCTOR DEVICE
25
Patent #:
9171812
Issue Dt:
10/27/2015
Application #:
14088882
Filing Dt:
11/25/2013
Title:
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PADS WITH NECK-DOWN PORTIONS TO PREVENT SOLDER REFLOW
26
Patent #:
9478517
Issue Dt:
10/25/2016
Application #:
14097214
Filing Dt:
12/04/2013
Publication #:
US20150049421
Pub Dt:
02/19/2015
Title:
ELECTRONIC DEVICE PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
27
Patent #:
9275939
Issue Dt:
03/01/2016
Application #:
14106139
Filing Dt:
12/13/2013
Title:
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH A COMBINATION OF LEADS AND LANDS AND METHOD
28
Patent #:
8963301
Issue Dt:
02/24/2015
Application #:
14142457
Filing Dt:
12/27/2013
Title:
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
29
Patent #:
8890337
Issue Dt:
11/18/2014
Application #:
14152035
Filing Dt:
01/10/2014
Title:
COLUMN AND STACKING BALLS PACKAGE FABRICATION METHOD AND STRUCTURE
30
Patent #:
8890337
Issue Dt:
11/18/2014
Application #:
14152035
Filing Dt:
01/10/2014
Title:
COLUMN AND STACKING BALLS PACKAGE FABRICATION METHOD AND STRUCTURE
31
Patent #:
9437575
Issue Dt:
09/06/2016
Application #:
14159237
Filing Dt:
01/20/2014
Title:
SEMICONDUCTOR DEVICE PACKAGE FORMED IN A CHIP-ON-WAFER LAST PROCESS USING THIN FILM ADHESIVES
32
Patent #:
NONE
Issue Dt:
Application #:
14172611
Filing Dt:
02/04/2014
Publication #:
US20150221570
Pub Dt:
08/06/2015
Title:
THIN SANDWICH EMBEDDED PACKAGE
33
Patent #:
9711485
Issue Dt:
07/18/2017
Application #:
14172889
Filing Dt:
02/04/2014
Title:
THIN BONDED INTERPOSER PACKAGE
34
Patent #:
8941250
Issue Dt:
01/27/2015
Application #:
14182083
Filing Dt:
02/17/2014
Title:
ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD AND STRUCTURE
35
Patent #:
9449946
Issue Dt:
09/20/2016
Application #:
14218265
Filing Dt:
03/18/2014
Publication #:
US20140284785
Pub Dt:
09/25/2014
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
36
Patent #:
9704747
Issue Dt:
07/11/2017
Application #:
14218292
Filing Dt:
03/18/2014
Publication #:
US20140291844
Pub Dt:
10/02/2014
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
37
Patent #:
9012789
Issue Dt:
04/21/2015
Application #:
14246286
Filing Dt:
04/07/2014
Title:
STACKABLE VIA PACKAGE AND METHOD
38
Patent #:
NONE
Issue Dt:
Application #:
14255726
Filing Dt:
04/17/2014
Publication #:
US20150303170
Pub Dt:
10/22/2015
Title:
SINGULATED UNIT SUBSTRATE FOR A SEMICONDCUTOR DEVICE
39
Patent #:
10032699
Issue Dt:
07/24/2018
Application #:
14264027
Filing Dt:
04/28/2014
Title:
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLICATIONS
40
Patent #:
8952522
Issue Dt:
02/10/2015
Application #:
14264970
Filing Dt:
04/29/2014
Title:
WAFER LEVEL PACKAGE AND FABRICATION METHOD
41
Patent #:
9184118
Issue Dt:
11/10/2015
Application #:
14268877
Filing Dt:
05/02/2014
Publication #:
US20140327122
Pub Dt:
11/06/2014
Title:
MICRO LEAD FRAME STRUCTURE HAVING REINFORCING PORTIONS AND METHOD
42
Patent #:
9875980
Issue Dt:
01/23/2018
Application #:
14286263
Filing Dt:
05/23/2014
Publication #:
US20150340332
Pub Dt:
11/26/2015
Title:
COPPER PILLAR SIDEWALL PROTECTION
43
Patent #:
9793180
Issue Dt:
10/17/2017
Application #:
14313363
Filing Dt:
06/24/2014
Publication #:
US20150206807
Pub Dt:
07/23/2015
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
44
Patent #:
9484331
Issue Dt:
11/01/2016
Application #:
14313724
Filing Dt:
06/24/2014
Publication #:
US20150221573
Pub Dt:
08/06/2015
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
45
Patent #:
9287229
Issue Dt:
03/15/2016
Application #:
14337146
Filing Dt:
07/21/2014
Publication #:
US20150021764
Pub Dt:
01/22/2015
Title:
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS
46
Patent #:
NONE
Issue Dt:
Application #:
14399633
Filing Dt:
12/05/2014
Publication #:
US20150120498
Pub Dt:
04/30/2015
Title:
METHOD FOR ASSISTING IN LOCATING A DESIRED ITEM IN A STORAGE LOCATION
47
Patent #:
9607919
Issue Dt:
03/28/2017
Application #:
14444450
Filing Dt:
07/28/2014
Publication #:
US20150255361
Pub Dt:
09/10/2015
Title:
SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS
48
Patent #:
9917063
Issue Dt:
03/13/2018
Application #:
14447415
Filing Dt:
07/30/2014
Publication #:
US20150035141
Pub Dt:
02/05/2015
Title:
SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF
49
Patent #:
10707181
Issue Dt:
07/07/2020
Application #:
14449654
Filing Dt:
08/01/2014
Publication #:
US20150221601
Pub Dt:
08/06/2015
Title:
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DUMMY SUBSTRATES
50
Patent #:
NONE
Issue Dt:
Application #:
14452933
Filing Dt:
08/06/2014
Publication #:
US20150041980
Pub Dt:
02/12/2015
Title:
Semiconductor Package with Reduced Thickness
51
Patent #:
9513254
Issue Dt:
12/06/2016
Application #:
14455975
Filing Dt:
08/11/2014
Publication #:
US20150041324
Pub Dt:
02/12/2015
Title:
MICROFLUIDIC SENSOR PACKAGE STRUCTURE AND METHOD
52
Patent #:
9412729
Issue Dt:
08/09/2016
Application #:
14456226
Filing Dt:
08/11/2014
Publication #:
US20150041975
Pub Dt:
02/12/2015
Title:
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
53
Patent #:
9343427
Issue Dt:
05/17/2016
Application #:
14477363
Filing Dt:
09/04/2014
Publication #:
US20150279811
Pub Dt:
10/01/2015
Title:
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY
54
Patent #:
10090230
Issue Dt:
10/02/2018
Application #:
14496764
Filing Dt:
09/25/2014
Publication #:
US20150084185
Pub Dt:
03/26/2015
Title:
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE
55
Patent #:
9462704
Issue Dt:
10/04/2016
Application #:
14517403
Filing Dt:
10/17/2014
Title:
EXTENDED LANDING PAD SUBSTRATE PACKAGE STRUCTURE AND METHOD
56
Patent #:
9184148
Issue Dt:
11/10/2015
Application #:
14521417
Filing Dt:
10/22/2014
Publication #:
US20150115422
Pub Dt:
04/30/2015
Title:
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
57
Patent #:
9418922
Issue Dt:
08/16/2016
Application #:
14524443
Filing Dt:
10/27/2014
Publication #:
US20150221586
Pub Dt:
08/06/2015
Title:
SEMICONDUCTOR DEVICE WITH REDUCED THICKNESS
58
Patent #:
9704842
Issue Dt:
07/11/2017
Application #:
14532532
Filing Dt:
11/04/2014
Publication #:
US20150125993
Pub Dt:
05/07/2015
Title:
INTERPOSER, MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR FABRICATING THE SEMICONDUCTOR PACKAGE
59
Patent #:
NONE
Issue Dt:
Application #:
14538018
Filing Dt:
11/11/2014
Publication #:
US20150130054
Pub Dt:
05/14/2015
Title:
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
60
Patent #:
NONE
Issue Dt:
Application #:
14546484
Filing Dt:
11/18/2014
Publication #:
US20150255426
Pub Dt:
09/10/2015
Title:
SEMICONDUCTOR DEVICE WITH REDUCED WARPAGE
Assignor
1
AMKOR TECHNOLOGY, INC.
Exec Dt:
04/09/2015
Assignee
1
BANK OF AMERICA, N.A.
901 MAIN STREET, 11TH FLOOR
DALLAS, TEXAS 75202
Correspondence name and address
STEPHEN P. DEMM - HUNTON & WILLIAMS LLP
951 EAST BYRD STREET
RIVERFRONT PLAZA - EAST TOWER
RICHMOND, VA 23219-4074

Search Results as of: 05/24/2024 02:37 PM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT