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Reel/Frame:045462/0592   Pages: 5
Recorded: 04/06/2018
Attorney Dkt #:2015-0367/24061.3148US02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/28/2020
Application #:
15947287
Filing Dt:
04/06/2018
Publication #:
Pub Dt:
08/16/2018
Title:
Method for Integrated Circuit Patterning
Assignors
1
Exec Dt:
08/25/2015
2
Exec Dt:
08/25/2015
3
Exec Dt:
08/25/2015
4
Exec Dt:
08/25/2015
5
Exec Dt:
08/25/2015
6
Exec Dt:
08/25/2015
7
Exec Dt:
08/25/2015
8
Exec Dt:
08/25/2015
Assignee
1
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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