Patent Assignment Details
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Reel/Frame: | 015196/0593 | |
| Pages: | 2 |
| | Recorded: | 04/07/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/10/2006
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Application #:
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10820494
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Filing Dt:
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04/07/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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METHOD AND APPARATUS FOR ESTABLISHING IMPROVED THERMAL COMMUNICATION BETWEEN A DIE AND A HEATSPREADER IN A SEMICONDUCTOR PACKAGE
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Assignee
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1621 BARDER LANE |
MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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LSI LOGIC CORPORATION
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1621 BARBER LANE
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MS: D-106 LEGAL
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MILPITAS, CA 95035
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