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Reel/Frame:051621/0600   Pages: 7
Recorded: 01/25/2020
Attorney Dkt #:P201806118US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/05/2021
Application #:
16752642
Filing Dt:
01/25/2020
Publication #:
Pub Dt:
07/29/2021
Title:
Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure
Assignors
1
Exec Dt:
01/22/2020
2
Exec Dt:
01/23/2020
3
Exec Dt:
01/23/2020
4
Exec Dt:
01/21/2020
5
Exec Dt:
01/22/2020
6
Exec Dt:
01/21/2020
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
INTELLETEK LAW GROUP, PLLC
GABRIEL DANIEL
800 2ND AVENUE, SUITE 804
NEW YORK, NY 10017

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