Patent Assignment Details
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| Reel/Frame: | 007588/0602 | |
| Pages: | 3 |
| | Recorded: | 06/05/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/1987
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Application #:
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06728647
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Filing Dt:
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04/29/1985
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Title:
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HEAT SINK MOUNTING ARRANGEMENT FOR A SEMICONDUCTOR
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Assignee
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| MAIL STOP 507 PATENTS DEPT. |
| 2805 E. COLUMBIA RD. |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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LIA M. PAPPAS
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MAIL STOP 507 PATENT DEPT.
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2805 E. COLUMBIA RD.
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BOISE, ID 83706
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