Patent Assignment Details
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| Reel/Frame: | 047091/0609 | |
| Pages: | 3 |
| | Recorded: | 09/14/2018 | | |
| Attorney Dkt #: | HZTC-HS162082PUS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16131149
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Filing Dt:
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09/14/2018
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Publication #:
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Pub Dt:
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01/10/2019
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Title:
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SUBSTRATE FOR CHIP PACKAGE
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Assignee
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| FLOOR 13, PHASE B, TENGFEI INDUSTRIAL BUILDING |
| FUTIAN FREE TRADE ZONE |
| SHENZHEN, CHINA 518045 |
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Correspondence name and address
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FIRSTIPR
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4320 BELVEDERE DR
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PLANO, TX 75093
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05/23/2024 09:45 AM
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