Total properties:
59
|
|
Patent #:
|
|
Issue Dt:
|
12/07/2004
|
Application #:
|
09802443
|
Filing Dt:
|
03/09/2001
|
Publication #:
|
|
Pub Dt:
|
03/14/2002
| | | | |
Title:
|
FLIP CHIP-IN-LEADFRAME PACKAGE AND PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2004
|
Application #:
|
09802664
|
Filing Dt:
|
03/09/2001
|
Publication #:
|
|
Pub Dt:
|
12/27/2001
| | | | |
Title:
|
A METHOD OF FORMING A FLIP CHIP INTERCONNECTION STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/02/2003
|
Application #:
|
09919763
|
Filing Dt:
|
07/31/2001
|
Publication #:
|
|
Pub Dt:
|
02/06/2003
| | | | |
Title:
|
PLASTIC BALL GRID ARRAY PACKAGE WITH INTEGRAL HEATSINK
|
|
|
Patent #:
|
|
Issue Dt:
|
09/06/2005
|
Application #:
|
10080384
|
Filing Dt:
|
02/22/2002
|
Publication #:
|
|
Pub Dt:
|
10/17/2002
| | | | |
Title:
|
SELF-COPLANARITY BUMPING SHAPE FOR FLIP CHIP
|
|
|
Patent #:
|
|
Issue Dt:
|
08/24/2004
|
Application #:
|
10081425
|
Filing Dt:
|
02/22/2002
|
Publication #:
|
|
Pub Dt:
|
09/05/2002
| | | | |
Title:
|
APPARATUS AND PROCESS FOR PRECISE ENCAPSULATION OF FLIP CHIP INTERCONNNECTS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2003
|
Application #:
|
10081490
|
Filing Dt:
|
02/22/2002
|
Publication #:
|
|
Pub Dt:
|
11/07/2002
| | | | |
Title:
|
PLASTIC SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/18/2004
|
Application #:
|
10081491
|
Filing Dt:
|
02/22/2002
|
Publication #:
|
|
Pub Dt:
|
10/17/2002
| | | | |
Title:
|
CHIP SCALE PACKAGE WITH FLIP CHIP INTERCONNECT
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2003
|
Application #:
|
10082914
|
Filing Dt:
|
02/26/2002
|
Publication #:
|
|
Pub Dt:
|
09/12/2002
| | | | |
Title:
|
TAPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE STRUCTURE AND ASSEMBLY PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/22/2005
|
Application #:
|
10608843
|
Filing Dt:
|
06/27/2003
|
Publication #:
|
|
Pub Dt:
|
03/04/2004
| | | | |
Title:
|
METHOD FOR MANUFACTURING PLASTIC BALL GRID ARRAY WITH INTEGRAL HEATSINK
|
|
|
Patent #:
|
|
Issue Dt:
|
04/25/2006
|
Application #:
|
10618933
|
Filing Dt:
|
07/14/2003
|
Publication #:
|
|
Pub Dt:
|
10/07/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING PROCESSOR AND MEMORY PACKAGE ASSEMBLIES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
10632549
|
Filing Dt:
|
08/02/2003
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2005
|
Application #:
|
10632550
|
Filing Dt:
|
08/02/2003
|
Publication #:
|
|
Pub Dt:
|
03/25/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE INCLUDING STACKED-DIE PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2005
|
Application #:
|
10632551
|
Filing Dt:
|
08/02/2003
|
Publication #:
|
|
Pub Dt:
|
04/08/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES AND HAVING ELECTRICAL SHIELD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10632553
|
Filing Dt:
|
08/02/2003
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-DOWN FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/17/2007
|
Application #:
|
10632568
|
Filing Dt:
|
08/02/2003
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2006
|
Application #:
|
10681583
|
Filing Dt:
|
10/08/2003
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA) PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/23/2006
|
Application #:
|
10681584
|
Filing Dt:
|
10/08/2003
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND INCLUDING ADDITIONAL DIE OR STACKED PACKAGE ON SECOND PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10681734
|
Filing Dt:
|
10/08/2003
|
Publication #:
|
|
Pub Dt:
|
06/24/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED BUMP CHIP CARRIER SECOND PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2005
|
Application #:
|
10681747
|
Filing Dt:
|
10/08/2003
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA) PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2005
|
Application #:
|
10681833
|
Filing Dt:
|
10/08/2003
|
Publication #:
|
|
Pub Dt:
|
07/01/2004
| | | | |
Title:
|
SEMICONDUCTOR STACKED MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND ELECTRICALLY SHIELDED FIRST PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/25/2006
|
Application #:
|
10850093
|
Filing Dt:
|
05/20/2004
|
Publication #:
|
|
Pub Dt:
|
10/28/2004
| | | | |
Title:
|
FLIP CHIP INTERCONNECTION STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/2008
|
Application #:
|
10882078
|
Filing Dt:
|
06/30/2004
|
Publication #:
|
|
Pub Dt:
|
02/03/2005
| | | | |
Title:
|
METHOD AND APPARATUS FOR FLIP CHIP ATTACHMENT BY POST COLLAPSE RE-MELT AND RE-SOLIDIFICATION OF BUMPS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/11/2006
|
Application #:
|
10959713
|
Filing Dt:
|
10/06/2004
|
Publication #:
|
|
Pub Dt:
|
09/08/2005
| | | | |
Title:
|
DBG SYSTEM AND METHOD WITH ADHESIVE LAYER SEVERING
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2008
|
Application #:
|
10971202
|
Filing Dt:
|
10/22/2004
|
Publication #:
|
|
Pub Dt:
|
10/06/2005
| | | | |
Title:
|
WIRE BOND CAPILLARY TIP
|
|
|
Patent #:
|
|
Issue Dt:
|
12/11/2007
|
Application #:
|
10976601
|
Filing Dt:
|
10/29/2004
|
Publication #:
|
|
Pub Dt:
|
09/22/2005
| | | | |
Title:
|
SEMICONDUCTOR CHIP PACKAGING METHOD WITH INDIVIDUALLY PLACED FILM ADHESIVE PIECES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2010
|
Application #:
|
10977047
|
Filing Dt:
|
10/29/2004
|
Publication #:
|
|
Pub Dt:
|
10/06/2005
| | | | |
Title:
|
BONDING TOOL FOR MOUNTING SEMICONDUCTOR CHIPS
|
|
|
Patent #:
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|
Issue Dt:
|
04/25/2006
|
Application #:
|
10983898
|
Filing Dt:
|
11/08/2004
|
Publication #:
|
|
Pub Dt:
|
05/12/2005
| | | | |
Title:
|
FLIP CHIP INTERCONNECTION PAD LAYOUT
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/2008
|
Application #:
|
10985654
|
Filing Dt:
|
11/10/2004
|
Publication #:
|
|
Pub Dt:
|
05/26/2005
| | | | |
Title:
|
BUMP-ON-LEAD FLIP CHIP INTERCONNECTION
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2015
|
Application #:
|
11014257
|
Filing Dt:
|
12/16/2004
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
Title:
|
Multiple chip package module having inverted package stacked over die
|
|
|
Patent #:
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|
Issue Dt:
|
04/06/2010
|
Application #:
|
11027002
|
Filing Dt:
|
12/31/2004
|
Publication #:
|
|
Pub Dt:
|
07/21/2005
| | | | |
Title:
|
DIE ATTACH BY TEMPERATURE GRADIENT LEAD FREE SOFT SOLDER METAL SHEET OR FILM
|
|
|
Patent #:
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|
Issue Dt:
|
09/05/2006
|
Application #:
|
11059274
|
Filing Dt:
|
02/16/2005
|
Publication #:
|
|
Pub Dt:
|
07/07/2005
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA) PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2013
|
Application #:
|
11134845
|
Filing Dt:
|
05/20/2005
|
Publication #:
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|
Pub Dt:
|
12/08/2005
| | | | |
Title:
|
ADHESIVE/SPACER ISLAND STRUCTURE FOR STACKING OVER WIRE BONDED DIE
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|
|
Patent #:
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|
Issue Dt:
|
05/15/2007
|
Application #:
|
11213058
|
Filing Dt:
|
08/26/2005
|
Publication #:
|
|
Pub Dt:
|
01/26/2006
| | | | |
Title:
|
METHOD FOR MANUFACTURING PLASTIC BALL GRID ARRAY PACKAGE WITH INTEGRAL HEATSINK
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|
Patent #:
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|
Issue Dt:
|
04/24/2007
|
Application #:
|
11252193
|
Filing Dt:
|
10/17/2005
|
Publication #:
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|
Pub Dt:
|
04/20/2006
| | | | |
Title:
|
MULTICHIP LEADFRAME PACKAGE
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|
|
Patent #:
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|
Issue Dt:
|
08/14/2007
|
Application #:
|
11252990
|
Filing Dt:
|
10/18/2005
|
Publication #:
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|
Pub Dt:
|
05/04/2006
| | | | |
Title:
|
METHOD FOR REDUCING SEMICONDUCTOR DIE WARPAGE
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Patent #:
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Issue Dt:
|
11/18/2008
|
Application #:
|
11273635
|
Filing Dt:
|
11/14/2005
|
Publication #:
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|
Pub Dt:
|
06/01/2006
| | | | |
Title:
|
WIRE BOND INTERCONNECTION
|
|
|
Patent #:
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|
Issue Dt:
|
03/02/2010
|
Application #:
|
11274925
|
Filing Dt:
|
11/14/2005
|
Publication #:
|
|
Pub Dt:
|
08/31/2006
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE HAVING DOUBLE LAYER LEADFRAME
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|
|
Patent #:
|
|
Issue Dt:
|
11/29/2011
|
Application #:
|
11280971
|
Filing Dt:
|
11/15/2005
|
Publication #:
|
|
Pub Dt:
|
08/31/2006
| | | | |
Title:
|
CHIP SCALE PACKAGE HAVING FLIP CHIP INTERCONNECT ON DIE PADDLE
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|
|
Patent #:
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|
Issue Dt:
|
02/01/2011
|
Application #:
|
11282293
|
Filing Dt:
|
11/17/2005
|
Publication #:
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|
Pub Dt:
|
08/31/2006
| | | | |
Title:
|
SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBLE SPACER
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|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11337168
|
Filing Dt:
|
01/20/2006
|
Publication #:
|
|
Pub Dt:
|
06/29/2006
| | | | |
Title:
|
Semiconductor multi-package module having inverted second package stacked over die-down flip-chip ball grid array (BGA) package
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|
|
Patent #:
|
|
Issue Dt:
|
10/30/2007
|
Application #:
|
11337821
|
Filing Dt:
|
01/23/2006
|
Publication #:
|
|
Pub Dt:
|
06/29/2006
| | | | |
Title:
|
METHOD FOR MAKING SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND INCLUDING ADDITIONAL DIE OR PACKAGE STACKED ON SECOND PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2007
|
Application #:
|
11337944
|
Filing Dt:
|
01/23/2006
|
Publication #:
|
|
Pub Dt:
|
07/20/2006
| | | | |
Title:
|
METHOD FOR MAKING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED BUMP CHIP CARRIER SECOND PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/11/2007
|
Application #:
|
11355920
|
Filing Dt:
|
02/16/2006
|
Publication #:
|
|
Pub Dt:
|
07/13/2006
| | | | |
Title:
|
METHOD FOR MAKING A SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING A PROCESSOR AND MEMORY PACKAGE ASSEMBLIES
|
|
|
Patent #:
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|
Issue Dt:
|
01/16/2007
|
Application #:
|
11374383
|
Filing Dt:
|
03/13/2006
|
Publication #:
|
|
Pub Dt:
|
08/03/2006
| | | | |
Title:
|
METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA)
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|
|
Patent #:
|
|
Issue Dt:
|
10/09/2007
|
Application #:
|
11374468
|
Filing Dt:
|
03/13/2006
|
Publication #:
|
|
Pub Dt:
|
08/03/2006
| | | | |
Title:
|
METHOD FOR MAKING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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|
|
Patent #:
|
|
Issue Dt:
|
03/23/2010
|
Application #:
|
11374472
|
Filing Dt:
|
03/13/2006
|
Publication #:
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|
Pub Dt:
|
08/03/2006
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-DOWN FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
|
|
|
Patent #:
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|
Issue Dt:
|
01/07/2014
|
Application #:
|
11530841
|
Filing Dt:
|
09/11/2006
|
Publication #:
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|
Pub Dt:
|
01/18/2007
| | | | |
Title:
|
ADHESIVE/SPACER ISLAND STRUCTURE FOR MULTIPLE DIE PACKAGE
|
|
|
Patent #:
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|
Issue Dt:
|
10/04/2011
|
Application #:
|
11536424
|
Filing Dt:
|
09/28/2006
|
Publication #:
|
|
Pub Dt:
|
01/25/2007
| | | | |
Title:
|
STACKED SEMICONDUCTOR PACKAGE HAVING ADHESIVE/SPACER STRUCTURE AND INSULATION
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|
|
Patent #:
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|
Issue Dt:
|
04/01/2008
|
Application #:
|
11622993
|
Filing Dt:
|
01/12/2007
|
Publication #:
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|
Pub Dt:
|
05/17/2007
| | | | |
Title:
|
METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING A SECOND PACKAGE SUBSTRATE WITH AN EXPOSED METAL LAYER WIRE BONDED TO A FIRST PACKAGE SUBSTRATE
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|
|
Patent #:
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|
Issue Dt:
|
12/29/2009
|
Application #:
|
11684265
|
Filing Dt:
|
03/09/2007
|
Publication #:
|
|
Pub Dt:
|
07/05/2007
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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|
|
Patent #:
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|
Issue Dt:
|
10/14/2008
|
Application #:
|
11686010
|
Filing Dt:
|
03/14/2007
|
Publication #:
|
|
Pub Dt:
|
07/05/2007
| | | | |
Title:
|
MULTICHIP LEADFRAME PACKAGE
|
|
|
Patent #:
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|
Issue Dt:
|
10/04/2011
|
Application #:
|
11697433
|
Filing Dt:
|
04/06/2007
|
Publication #:
|
|
Pub Dt:
|
08/02/2007
| | | | |
Title:
|
PLASTIC BALL GRID ARRAY PACKAGE WITH INTEGRAL HEATSINK
|
|
|
Patent #:
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|
Issue Dt:
|
06/08/2010
|
Application #:
|
11744182
|
Filing Dt:
|
05/03/2007
|
Publication #:
|
|
Pub Dt:
|
02/14/2008
| | | | |
Title:
|
SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-UP FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2012
|
Application #:
|
11849112
|
Filing Dt:
|
08/31/2007
|
Publication #:
|
|
Pub Dt:
|
12/20/2007
| | | | |
Title:
|
METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2009
|
Application #:
|
11880893
|
Filing Dt:
|
07/23/2007
|
Publication #:
|
|
Pub Dt:
|
01/24/2008
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Title:
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METHOD FOR MAKING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED WIRE BOND CARRIER SECOND PACKAGE
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Patent #:
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Issue Dt:
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07/06/2010
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Application #:
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11953857
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Filing Dt:
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12/10/2007
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Publication #:
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Pub Dt:
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01/29/2009
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Title:
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METHOD OF FABRICATING A SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING A PROCESSOR AND MEMORY PACKAGE ASSEMBLIES
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Patent #:
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Issue Dt:
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06/29/2010
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Application #:
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12032159
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Filing Dt:
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02/15/2008
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Publication #:
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Pub Dt:
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06/12/2008
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Title:
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WIRE BOND INTERCONNECTION
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Patent #:
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Issue Dt:
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05/03/2011
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Application #:
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12767693
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Filing Dt:
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04/26/2010
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Publication #:
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Pub Dt:
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08/12/2010
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-UP FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
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07/26/2011
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Application #:
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12783039
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Filing Dt:
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05/19/2010
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Publication #:
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Pub Dt:
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09/09/2010
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Title:
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WIRE BOND INTERCONNECTION
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