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Patent Assignment Details
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Reel/Frame:042484/0613   Pages: 3
Recorded: 05/24/2017
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/26/2018
Application #:
14759928
Filing Dt:
07/08/2015
Publication #:
Pub Dt:
09/22/2016
Title:
METHOD OF FORMING COPPER INTERCONNECTS
Assignor
1
Exec Dt:
06/26/2015
Assignee
1
497 GAOSI ROAD, ZHANGJIANG HI-TECH PARK, PUDONG
SHANGHAI, CHINA 201210
Correspondence name and address
SHANGHAI IC R&D CENTER CO., LTD
497 GAOSI ROAD, ZHANGJIANG HI-TECH PARK, PUDONG
SHANGHAI, 201210 CHINA

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