Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 052382/0630 | |
| Pages: | 8 |
| | Recorded: | 04/13/2020 | | |
| Attorney Dkt #: | 010829-9096.US04 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/18/2021
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Application #:
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16773716
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Filing Dt:
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01/27/2020
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Publication #:
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Pub Dt:
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07/23/2020
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Title:
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CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL EXPANSION MATERIALS AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
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Assignee
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| 8000 S. FEDERAL WAY, P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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PO BOX 1247
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SEATTLE, WA 98111-1247
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05/23/2024 04:52 AM
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