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Patent Assignment Details
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Reel/Frame:010150/0631   Pages: 5
Recorded: 04/29/1999
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/02/2003
Application #:
09301889
Filing Dt:
04/29/1999
Title:
METHOD FOR TESTING CHIPS ON FLAT SOLDER BUMPS
Assignors
1
Exec Dt:
04/12/1999
2
Exec Dt:
04/12/1999
3
Exec Dt:
04/05/1999
4
Exec Dt:
04/05/1999
5
Exec Dt:
04/05/1999
Assignee
1
ARMONK, NEW YORK 10504
Correspondence name and address
TUNG & ASSOCIATES
RANDY W. TUNG
838 W. LONG LAKE ROAD
SUITE 120
BLOOMFIELD HILLS, MICHIGAN 48302

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