Patent Assignment Details
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| Reel/Frame: | 022097/0655 | |
| Pages: | 5 |
| | Recorded: | 01/13/2009 | | |
| Attorney Dkt #: | P27076 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/04/2012
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Application #:
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12164404
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Filing Dt:
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06/30/2008
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Publication #:
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Pub Dt:
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12/31/2009
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Title:
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FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| M/S SC4-202 |
| SANTA CLARA, CALIFORNIA 95052-5326 |
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Correspondence name and address
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INTEL CORPORATION C/O INTELLEVATE LLC
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P.O. BOX 52050
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MINNEAPOLIS, MN 55402
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