Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 004084/0660 | |
| Pages: | 1 |
| | Recorded: | 01/10/1983 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
3
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Patent #:
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Issue Dt:
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09/29/1981
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Application #:
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06122527
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Filing Dt:
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02/19/1980
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Title:
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CERAMIC LID ASSEMBLY FOR HERMETIC SEALING OF A SEMICONDUCTOR CHIP
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Patent #:
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Issue Dt:
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10/26/1982
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Application #:
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06235094
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Filing Dt:
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02/17/1981
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Title:
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METHOD OF MAKING CERAMIC LID ASSEMBLY FOR HERMETIC SEALING OF A SEMICONDUCTOR CHIP
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Patent #:
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Issue Dt:
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05/25/1982
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Application #:
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06243389
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Filing Dt:
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03/13/1981
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Title:
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LID ASSEMBLY FOR HERMETIC SEALING OF A SEMICONDUCTOR CHIP
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Correspondence name and address
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COUSINS & COUSINS
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20 VESEY STREET
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NEW YORK, NY. 10007
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