Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 040117/0673 | |
| Pages: | 5 |
| | Recorded: | 10/25/2016 | | |
| Attorney Dkt #: | 70027-2278 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15257770
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Filing Dt:
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09/06/2016
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Publication #:
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Pub Dt:
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03/09/2017
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SINGLE-LAYER SUPPORT STRUCTURE
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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WONG & REES LLP
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4340 STEVENS CREEK BLVD.
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SUITE 106
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SAN JOSE, CA 95129
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