Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 062214/0680 | |
| Pages: | 6 |
| | Recorded: | 12/27/2022 | | |
| Attorney Dkt #: | 2557SI-003705-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18058791
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Filing Dt:
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11/25/2022
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Publication #:
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Pub Dt:
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05/25/2023
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Title:
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LAYER STRUCTURES INCLUDING DIELECTRIC LAYER, METHODS OF MANUFACTURING DIELECTRIC LAYER, ELECTRONIC DEVICE INCLUDING DIELECTRIC LAYER, AND ELECTRONIC APPARATUS INCLUDING ELECTRONIC DEVICE
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Assignee
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, PLC
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11730 PLAZA AMERICA DRIVE, SUITE 600
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RESTON, VA 20190
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05/23/2024 06:36 AM
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