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Patent Assignment Details
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Reel/Frame:031539/0709   Pages: 5
Recorded: 11/04/2013
Attorney Dkt #:3356-12102, 12103, 12104
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 5
1
Patent #:
Issue Dt:
06/30/1998
Application #:
08497404
Filing Dt:
06/30/1995
Title:
SEMI-INSULATING WAFER
2
Patent #:
Issue Dt:
08/26/2014
Application #:
12719988
Filing Dt:
03/09/2010
Publication #:
Pub Dt:
08/04/2011
Title:
DIAMOND SOI WITH THIN SILICON NITRIDE LAYER AND RELATED METHODS
3
Patent #:
Issue Dt:
07/02/2013
Application #:
12887797
Filing Dt:
09/22/2010
Publication #:
Pub Dt:
08/04/2011
Title:
METHODS OF FORMING A SEMICONDUCTOR DEVICE
4
Patent #:
Issue Dt:
10/14/2014
Application #:
12966728
Filing Dt:
12/13/2010
Publication #:
Pub Dt:
06/16/2011
Title:
THERMAL MATCHING IN SEMICONDUCTOR DEVICES USING HEAT DISTRIBUTION STRUCTURES
5
Patent #:
Issue Dt:
04/08/2014
Application #:
13717899
Filing Dt:
12/18/2012
Publication #:
Pub Dt:
06/20/2013
Title:
METHODS OF FORMING A SEMICONDUCTOR DEVICE
Assignor
1
Exec Dt:
10/11/2013
Assignee
1
CHEMIN DES FRANQUES
PARC TECHNOLOGIQUE DES FONTAINES
BERNIN, FRANCE 38190
Correspondence name and address
TRASKBRITT
P.O. BOX 2550
SALT LAKE CITY, UT 84110

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