Patent Assignment Details
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| Reel/Frame: | 019035/0713 | |
| Pages: | 5 |
| | Recorded: | 03/21/2007 | | |
| Attorney Dkt #: | IVBS-0001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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09/24/2002
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Application #:
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09271179
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Filing Dt:
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03/17/1999
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Title:
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ARRANGEMENT AND METHOD FOR IMPROVED DOWNWARD SCALING OF HIGHER CONDUCTIVITY METAL-BASED INTERCONNECTS
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Patent #:
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Issue Dt:
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02/18/2003
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Application #:
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09619587
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Filing Dt:
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07/19/2000
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Title:
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METHOD FOR MAKING INTEGRATED CIRCUIT INCLUDING INTERCONNECTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09642140
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Filing Dt:
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08/18/2000
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Title:
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METHOD FOR MAKING INTEGRATED CIRCUIT INCLUDING INTERCONNECTS WITH ENHANCED ELECTROMIGRATION RESISTANCE USING DOPED SEED LAYER AND INTEGRATED CIRCUITS PRODUCED THEREBY
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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09672473
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Filing Dt:
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09/28/2000
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Title:
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DIFFUSION BARRIERS FOR COPPER INTERCONNECT SYSTEMS
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Patent #:
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Issue Dt:
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04/11/2006
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Application #:
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10803475
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Filing Dt:
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03/18/2004
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Publication #:
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Pub Dt:
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12/02/2004
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Title:
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COPPER INTERCONNECT SYSTEMS WHICH USE CONDUCTIVE, METAL-BASED CAP LAYERS
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Assignee
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| 2215-B RENAISSANCE DRIVE |
| SUITE 5 |
| LAS VEGAS, NEVADA 89119 |
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Correspondence name and address
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WOODCOCK WASHBURN LLP
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2929 ARCH STREET
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CIRA CENTER, 12TH FLOOR
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PHILADELPHIA, PA 19104-2891
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