Patent Assignment Details
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Reel/Frame: | 014891/0719 | |
| Pages: | 8 |
| | Recorded: | 07/22/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/13/2007
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Application #:
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10746810
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Filing Dt:
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12/24/2003
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Publication #:
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Pub Dt:
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12/02/2004
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Title:
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HIGH FREQUENCY CHIP PACKAGES WITH CONNECTING ELEMENTS
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Assignee
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3099 ORCHARD DRIVE |
SAN JOSE, CALIFORNIA 95134 |
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Correspondence name and address
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LERNER, DAVID, LITTENBERG, ET AL
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DARYL K. NEFF
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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