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Total properties:
26
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Patent #:
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Issue Dt:
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07/11/2000
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Application #:
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09235579
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Filing Dt:
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01/22/1999
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Title:
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SOLDER RETENTION RING FOR IMPROVED SOLDER BUMP FORMATION
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Patent #:
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Issue Dt:
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02/20/2001
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Application #:
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09326339
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Filing Dt:
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06/07/1999
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Title:
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DEMOUNTABLE HEAT SPREADER AND HIGH RELIABILITY FLIP CHIP PACKAGE ASSEMBLY
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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09415286
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Filing Dt:
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10/08/1999
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Title:
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LOW-STRESS INTERFACE BETWEEN MATERIALS HAVING DIFFERENT THERMAL COEFFICIENTS OF EXPANSION AND METHOD FOR FABRICATING SAME
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Patent #:
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Issue Dt:
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10/26/2004
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Application #:
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09456953
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Filing Dt:
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12/07/1999
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Title:
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MULTIMODAL OPTIMIZATION TECHNIQUE IN TEST GENERATION
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09675918
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Filing Dt:
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09/29/2000
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Title:
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METHOD FOR DELAY LINE LINEARITY TESTING
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Patent #:
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Issue Dt:
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04/29/2003
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Application #:
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09702481
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Filing Dt:
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10/31/2000
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Title:
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HIGH DENSITY CONTACT ARRANGEMENT
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Patent #:
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Issue Dt:
|
06/10/2003
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Application #:
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09723831
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Filing Dt:
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11/28/2000
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Title:
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SYSTEMS AND METHODS FOR FACILITATING TESTING OF PAD RECEIVERS OF INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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10000614
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Filing Dt:
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10/30/2001
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Publication #:
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Pub Dt:
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03/28/2002
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Title:
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APPARATUS AND METHOD FOR HANDLING AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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07/13/2004
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Application #:
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10125338
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Filing Dt:
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04/18/2002
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Publication #:
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Pub Dt:
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10/23/2003
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Title:
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SYSTEMS AND METHODS FOR FACILITATING DRIVER STRENGTH TESTING OF INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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10176321
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Filing Dt:
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06/20/2002
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Publication #:
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Pub Dt:
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12/25/2003
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Title:
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SYSTEM AND METHOD FOR TESTING INTEGRATED CIRCUITS BY TRANSIENT SIGNAL ANALYSIS
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Patent #:
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Issue Dt:
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03/01/2005
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Application #:
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10232483
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Filing Dt:
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08/30/2002
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Publication #:
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Pub Dt:
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03/04/2004
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Title:
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APPARATUS AND METHOD FOR CONTROLLING MOVEMENT OF A DEVICE AFTER PACKAGING
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Patent #:
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Issue Dt:
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07/15/2008
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Application #:
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10320905
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Filing Dt:
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12/16/2002
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Publication #:
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Pub Dt:
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06/17/2004
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Title:
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SEMICONDUCTOR CHIP PACKAGE WITH A PACKAGE SUBSTRATE AND A LID COVER
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10369069
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Filing Dt:
|
02/19/2003
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Title:
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SYSTEMS AND METHODS FOR TESTING INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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06/14/2005
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Application #:
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10383668
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Filing Dt:
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03/07/2003
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Publication #:
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Pub Dt:
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08/21/2003
| | | | |
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Title:
|
SYSTEMS AND METHODS FOR FACILITATING TESTING OF PAD RECEIVERS OF INTEGRATED CIRCUITS
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|
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Patent #:
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Issue Dt:
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08/23/2005
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Application #:
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10627317
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Filing Dt:
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07/24/2003
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Publication #:
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Pub Dt:
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01/27/2005
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Title:
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HIGH SPEED CHANNEL SELECTOR SWITCH
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Patent #:
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Issue Dt:
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05/29/2007
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Application #:
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10669982
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Filing Dt:
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09/23/2003
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Publication #:
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Pub Dt:
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03/24/2005
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Title:
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VIA PLACEMENT FOR LAYER TRANSITIONS IN FLEXIBLE CIRCUITS WITH HIGH DENSITY BALL GRID ARRAYS
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Patent #:
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Issue Dt:
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09/20/2005
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Application #:
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10677079
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Filing Dt:
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10/01/2003
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Publication #:
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Pub Dt:
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04/01/2004
| | | | |
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Title:
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HEAT TRANSFER APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT AND HEAT SINK ASSEMBLY
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Patent #:
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Issue Dt:
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02/22/2005
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Application #:
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10737435
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Filing Dt:
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12/16/2003
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Publication #:
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Pub Dt:
|
07/08/2004
| | | | |
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Title:
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SYSTEMS AND METHODS FOR TESTING RECEIVER TERMINATIONS IN INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
|
01/11/2011
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Application #:
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10820484
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Filing Dt:
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04/08/2004
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Publication #:
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Pub Dt:
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10/13/2005
| | | | |
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Title:
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THERMAL DISSIPATION IN INTEGRATED CIRCUIT SYSTEMS
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Patent #:
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|
Issue Dt:
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09/21/2010
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Application #:
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11216105
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Filing Dt:
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09/01/2005
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Publication #:
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Pub Dt:
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03/01/2007
| | | | |
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Title:
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QUAD FLAT PACK (QFP) PACKAGE AND FLEXIBLE POWER DISTRIBUTION METHOD THEREFOR
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|
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Patent #:
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|
Issue Dt:
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09/25/2007
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Application #:
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11234003
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Filing Dt:
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09/23/2005
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Publication #:
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Pub Dt:
|
03/29/2007
| | | | |
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Title:
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MODULAR BONDING PAD STRUCTURE AND METHOD
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|
|
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Patent #:
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|
Issue Dt:
|
09/04/2012
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Application #:
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11254088
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Filing Dt:
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10/19/2005
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Publication #:
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Pub Dt:
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04/19/2007
| | | | |
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Title:
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APPARATUS AND METHOD FOR PROVIDING BYPASS CAPACITANCE AND POWER ROUTING IN QFP PACKAGE
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|
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Patent #:
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Issue Dt:
|
07/15/2008
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Application #:
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11274572
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Filing Dt:
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11/14/2005
|
|
Publication #:
|
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Pub Dt:
|
05/17/2007
| | | | |
|
Title:
|
SYSTEM AND METHOD FOR IMPLEMENTING PACKAGE LEVEL IP PREVERIFICATION FOR SYSTEM ON CHIP DEVICES
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|
|
|
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Patent #:
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|
Issue Dt:
|
12/25/2007
|
Application #:
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11345104
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Filing Dt:
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01/31/2006
|
|
Publication #:
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|
Pub Dt:
|
06/15/2006
| | | | |
|
Title:
|
THERMALLY ENHANCED PACKAGE FOR AN INTEGRATED CIRCUIT
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|
|
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Patent #:
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|
Issue Dt:
|
12/29/2009
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Application #:
|
11431477
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Filing Dt:
|
05/10/2006
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|
Publication #:
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|
Pub Dt:
|
11/15/2007
| | | | |
|
Title:
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ELECTRONIC DEVICE HAVING A DIMENSIONALLY-STABLE ELECTRICALLY-CONDUCTIVE FLEXIBLE SUBSTRATE
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Patent #:
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Issue Dt:
|
01/19/2010
|
Application #:
|
11840387
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Filing Dt:
|
08/17/2007
|
|
Publication #:
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Pub Dt:
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12/06/2007
| | | | |
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Title:
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MODULAR BONDING PAD STRUCTURE AND METHOD
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